Datasheet > MT58L256L18P1F-5

MT58L256L18P1F-5

更新时间： 2023-08-15 00:00:00

品牌	Logo	应用领域
赛普拉斯 - CYPRESS		静态存储器
页数	文件大小	规格书
30页	466K
描述
Cache SRAM, 256KX18, 2.8ns, CMOS, PBGA165, FBGA-165

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4Mb: 256K x 18, 128K x 32/36

PIPELINED, SCD SYNCBURST SRAM

165-PINFBGA

0.85 0.075

0.12

SEATING PLANE

BALL A11

165X Ø 0.45

10.00

SOLDER BALL DIAMETER REFERS

TO POST REFLOW CONDITION. THE

PRE-REFLOW DIAMETER IS Ø 0.40

BALL A1

PIN A1 ID

1.20 MAX

1.00

TYP

PIN A1 ID

7.50 0.05

14.00

15.00 0.10

7.00 0.05

1.00

TYP

MOLD COMPOUND: EPOXY NOVOLAC

SUBSTRATE: PLASTIC LAMINATE

6.50 0.05

5.00 0.05

13.00 0.10

SOLDER BALL MATERIAL:

EUTECTIC 62% Sn, 36% Pb, 2% Ag

SOLDER BALL PAD: Ø .33mm

MAX

MIN

NOTE: 1. All dimensions in millimeters

or typical where noted.

DATASHEETDESIGNATIONS

No Marking: This data sheet contains minimum and maximum limits specified over the complete power supply

and temperature range for production devices. Although considered final, these specifications are

subject to change, as further product development and data characterization sometimes occur.

8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900

E-mail:prodmktg@micron.com,Internet:http://www.micronsemi.com,CustomerCommentLine:800-932-4992

Micron, the Micron logo, M logo, and SyncBurst are trademarks and/or service marks of Micron Technology, Inc.

4Mb:256Kx18, 128Kx32/36Pipelined, SCDSyncBurstSRAM

MT58L256L18P1_F.p65 – Rev. F, Pub. 1/03 EN

MicronTechnology,Inc.,reservestherighttochangeproductsorspecificationswithoutnotice.

1...26 27 282930

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