4Mb: 256K x 18, 128K x 32/36
PIPELINED, SCD SYNCBURST SRAM
REVISIONHISTORY
Updated package drawings ................................................................................................................................... January 9/03
Removed "Preliminary Package Data" from front page .............................................................................. February 22/02
Removed -4 speed grade
Removed 119-pin PBGA package and references .......................................................................................... February 2/02
Removed note "Not Recommended for New Designs," Rev. 6/01 ...................................................................... June 7/01
Added Industrial Temperature note and reference, Rev. 3/01 ........................................................................ March 6/01
Added 119-pin PBGA package, Rev. 1/01, FINAL ........................................................................................... January 10/01
Removed FBGA Part Marking Guide, REV 8/00-A, FINAL .............................................................................. August 22/00
Changed FBGA capacitance values, REV 8/00, FINAL ....................................................................................... August 7/00
CI; TYP 2.5pF from 4pF; MAX. 3.5pF from 5pF
CO; TYP 4pF from 6pF; MAX. 5pF from 7pF
CCK; TYP 2.5pF from 5pF; MAX. 3.5pF from 6pF
Added FBGA Part Marking Guide, Rev. 7/00, Preliminary .................................................................................. June 13/00
Added FBGA Part Marking References
Removed 119-Pin PBGA package and references
Removed industrial temperature references
Added 165-pin FBGA package, Rev. 6/00, Preliminary ........................................................................................ May 23/00
4Mb:256Kx18, 128Kx32/36Pipelined, SCDSyncBurstSRAM
MT58L256L18P1_F.p65 – Rev. F, Pub. 1/03 EN
MicronTechnology,Inc.,reservestherighttochangeproductsorspecificationswithoutnotice.
©2003,MicronTechnology,Inc.
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