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MSCDC200H70AG-Module PDF预览

MSCDC200H70AG-Module

更新时间: 2024-11-21 14:53:59
品牌 Logo 应用领域
美国微芯 - MICROCHIP /
页数 文件大小 规格书
6页 752K
描述
SiC Schottky DiodeZero reverse recoveryZero forward recoveryTemperature Independent switching beha

MSCDC200H70AG-Module 数据手册

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MSCDC200H70AG SiC Diode Full Bridge Power Module  
1
Product Overview  
This section provides the product overview for the MSCDC200H70AG device.  
All ratings at Tj = 25 °C, unless otherwise specified.  
Caution: These devices are sensitive to electrostatic discharge. Proper handling procedures should be  
followed.  
MSCC-0344-DS-01019 Datasheet Revision 1.0  
1

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