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MS1608R27ML PDF预览

MS1608R27ML

更新时间: 2024-11-18 05:50:15
品牌 Logo 应用领域
ABC 电感器
页数 文件大小 规格书
6页 187K
描述
MULTILAYER CHIP INDUCTOR

MS1608R27ML 数据手册

 浏览型号MS1608R27ML的Datasheet PDF文件第2页浏览型号MS1608R27ML的Datasheet PDF文件第3页浏览型号MS1608R27ML的Datasheet PDF文件第4页浏览型号MS1608R27ML的Datasheet PDF文件第5页浏览型号MS1608R27ML的Datasheet PDF文件第6页 
SPECIFICATION FOR APPROVAL  
REF :  
PROD.  
NAME  
PAGE: 1  
ABC'S DWG NO.  
ABC'S ITEM NO.  
MS1608□□□□L-□□□  
MULTILAYER CHIP INDUCTOR  
Ⅰ﹒CONFIGURATION & DIMENSIONS:  
A
D
D
I
G
I
B
(PCB Pattern)  
Unit : m/m  
Series  
A
B
C
D
G
H
I
MS1608  
1.60±0.20  
0.80±0.20  
0.80±0.20  
0.30±0.20  
0.7  
0.7  
0.7  
Ⅱ﹒SCHEMATIC DIAGRAM:  
a
b
c
Ⅲ﹒MATERIALS:  
aBodyFerrite  
bInternal conductorSilver or Ag / Pd  
cTerminalCu/Sn  
dRemarkProducts comply with RoHS' requirements  
Ⅳ﹒GENERAL SPECIFICATION:  
aStorage temp.-40---- +105℃  
Peak Temp260max.  
bOperating temp.-25---- +85℃  
cTerminal strngth:  
Max time above 230℃ :50sec max.  
Max time above 200℃ :70sec max.  
Temperature  
Rising Area  
Preheat Area  
Reflow Area  
Forced Cooling Area  
+2.0 ~ 4.0  
/ sec max.  
F
+4.0/ sec max.  
150 ~ 200/ 60 ~ 120sec  
-(1.0 ~ 5.0)/ sec max.  
Peak Temperature:  
260  
250  
200  
150  
100  
50  
230℃  
Type  
F ( kgf )  
0.5  
time ( sec )  
50sec max.  
MS1608  
30±5  
70sec max.  
dSolderability:  
Solder : Sn96.5 / Ag3 / Cu0.5  
or equivalent  
Solder temp. : 260±5℃  
Flux : Rosin  
0
50  
100  
150  
200  
250  
Dip time : 4±1 seconds  
Time ( seconds )  
AR-001A  

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