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MPXA4100A6T1 PDF预览

MPXA4100A6T1

更新时间: 2024-09-13 20:55:03
品牌 Logo 应用领域
摩托罗拉 - MOTOROLA 传感器换能器
页数 文件大小 规格书
6页 411K
描述
ABSOLUTE, PEIZORESISTIVE PRESSURE SENSOR, 2.9-21.75Psi, 1.5%, 0.30-4.95V, SQUARE, THROUGH HOLE MOUNT, PLASTIC, SOP-8

MPXA4100A6T1 技术参数

生命周期:TransferredReach Compliance Code:unknown
风险等级:5.82最大精度 (%):1.5%
其他特性:TEMPERATURE COMPENSATED, SIGNAL CONDITIONED主体宽度:10.66 mm
主体高度:5.61 mm主体长度或直径:10.66 mm
外壳:PLASTIC线性度 (%):1.8 %
安装特点:THROUGH HOLE MOUNT标称偏移:0.30V
最大工作电流:10 mA最高工作温度:125 °C
最低工作温度:-40 °C输出范围:0.30-4.95V
输出类型:ANALOG VOLTAGE封装形状/形式:SQUARE
端口类型:HOLE最大压力范围:21.75 Psi
最小压力范围:2.9 Psi压力传感模式:ABSOLUTE
响应时间:1000 µs灵敏度(mV / V):54 mV/V
传感器/换能器类型:PRESSURE SENSOR,PIEZORESISTIVE最大供电电压:5.35 V
最小供电电压:4.85 V表面贴装:NO
端接类型:SOLDERBase Number Matches:1

MPXA4100A6T1 数据手册

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SEMICONDUCTOR TECHNICAL DATA  
INTEGRATED  
PRESSURE SENSOR  
The Motorola MPX4100A/MPXA4100A series Manifold Absolute Pressure (MAP)  
sensor for engine control is designed to sense absolute air pressure within the intake  
manifold. This measurement can be used to compute the amount of fuel required for each  
cylinder. The small form factor and high reliability of on–chip integration makes the  
Motorola MAP sensor a logical and economical choice for automotive system designers.  
The MPX4100A/MPXA4100A series piezoresistive transducer is a state–of–the–art,  
monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced  
micromachining techniques, thin film metallization, and bipolar semiconductor processing  
to provide an accurate, high level analog output signal that is proportional to applied  
pressure.  
15 to 115 kPa (2.2 to 16.7 psi)  
0.2 to 4.8 Volts Output  
UNIBODY PACKAGE  
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure  
sensor chip.  
MPX4100A  
CASE 867  
Features  
1.8% Maximum Error Over 0° to 85°C  
Specifically Designed for Intake Manifold Absolute  
Pressure Sensing in Engine Control Systems  
Temperature Compensated Over 40°C to +125°C  
Durable Epoxy Unibody Element or Thermoplastic  
(PPS) Surface Mount Package  
SMALL OUTLINE PACKAGE  
Application Examples  
Manifold Sensing for Automotive Systems  
Ideally suited for Microprocessor or Microcontroller–  
Based Systems  
MPX4100AP  
CASE 867B  
MPXA4100A6U  
CASE 482  
Also Ideal for Non–Automotive Applications  
V
S
THIN FILM  
TEMPERATURE  
COMPENSATION  
AND  
GAIN STAGE #2  
AND  
GROUND  
REFERENCE  
SHIFT CIRCUITRY  
SENSING  
ELEMENT  
MPXA4100AC6U  
CASE 482A  
V
MPX4100AS  
CASE 867E  
out  
GAIN STAGE #1  
PIN NUMBER  
PIN NUMBER  
PINS 1, 5, 6, 7 AND 8 ARE NO CONNECTS  
FOR SMALL OUTLINE PACKAGE DEVICE  
1
2
3
4
N/C  
5
6
7
8
N/C  
N/C  
N/C  
N/C  
1
2
3
V
4
5
6
N/C  
N/C  
N/C  
out  
Gnd  
GND  
V
S
PINS 4, 5 AND 6 ARE NO CONNECTS FOR  
UNIBODY DEVICE  
Gnd  
V
S
V
out  
NOTE: Pins 4, 5, and 6 are internal  
device connections. Do not connect  
to external circuitry or ground. Pin 1  
is noted by the notch in the lead.  
Figure 1. Fully Integrated Pressure Sensor  
Schematic  
NOTE: Pins 1, 5, 6, 7, and 8 are  
internal device connections. Do not  
connect to external circuitry or  
ground. Pin 1 is noted by the notch in  
the lead.  
REV 5  
3–64  
www.motorola.com/semiconductors  
Motorola Sensor Device Data  

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