生命周期: | Obsolete | 包装说明: | BGA, |
Reach Compliance Code: | unknown | 风险等级: | 5.66 |
地址总线宽度: | 32 | 位大小: | 32 |
最大时钟频率: | 25 MHz | 外部数据总线宽度: | 32 |
JESD-30 代码: | S-PBGA-B357 | 长度: | 25 mm |
端子数量: | 357 | 最高工作温度: | 70 °C |
最低工作温度: | 封装主体材料: | PLASTIC/EPOXY | |
封装代码: | BGA | 封装形状: | SQUARE |
封装形式: | GRID ARRAY | 认证状态: | Not Qualified |
座面最大高度: | 2.05 mm | 速度: | 25 MHz |
最大供电电压: | 3.78 V | 最小供电电压: | 2.85 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | COMMERCIAL | 端子形式: | BALL |
端子节距: | 1.27 mm | 端子位置: | BOTTOM |
宽度: | 25 mm | uPs/uCs/外围集成电路类型: | MICROPROCESSOR, RISC |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
MPC860DEZP40 | MOTOROLA |
获取价格 |
RISC Microprocessor, 32-Bit, 40MHz, CMOS, PBGA357, PLASTIC, BGA-357 |
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MPC860DEZQ50D4 | FREESCALE |
获取价格 |
Hardware Specifications |
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MPC860DEZQ50D4 | ROCHESTER |
获取价格 |
32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 |
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MPC860DEZQ50D4 | NXP |
获取价格 |
32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 |
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MPC860DEZQ50D4R2 | FREESCALE |
获取价格 |
Hardware Specifications |
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MPC860DEZQ66D4 | NXP |
获取价格 |
PowerQUICC, 32 Bit Power Architecture SoC, 66MHz, CPM, ENET, HDLC, PCMCIA, 0 to 95C |
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MPC860DEZQ66D4 | FREESCALE |
获取价格 |
Hardware Specifications |
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MPC860DEZQ80D4 | FREESCALE |
获取价格 |
Hardware Specifications |
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MPC860DEZQ80D4 | NXP |
获取价格 |
PowerQUICC, 32 Bit Power Architecture SoC, 80MHz, CPM, ENET, HDLC, PCMCIA, 0 to 95C |
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MPC860DP | MOTOROLA |
获取价格 |
Family Hardware Specifications |
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