是否Rohs认证: | 不符合 | 生命周期: | Transferred |
零件包装代码: | BGA | 包装说明: | BGA, BGA357,19X19,50 |
针数: | 357 | Reach Compliance Code: | not_compliant |
ECCN代码: | 5A991 | HTS代码: | 8542.31.00.01 |
风险等级: | 5.09 | 地址总线宽度: | 32 |
位大小: | 32 | 边界扫描: | YES |
最大时钟频率: | 50 MHz | 外部数据总线宽度: | 32 |
格式: | FIXED POINT | 集成缓存: | YES |
JESD-30 代码: | S-PBGA-B357 | JESD-609代码: | e0 |
长度: | 25 mm | 低功率模式: | YES |
湿度敏感等级: | 3 | 端子数量: | 357 |
最低工作温度: | 封装主体材料: | PLASTIC/EPOXY | |
封装代码: | BGA | 封装等效代码: | BGA357,19X19,50 |
封装形状: | SQUARE | 封装形式: | GRID ARRAY |
峰值回流温度(摄氏度): | 245 | 电源: | 3.3 V |
认证状态: | Not Qualified | 座面最大高度: | 2.52 mm |
速度: | 50 MHz | 子类别: | Microprocessors |
最大供电电压: | 3.465 V | 最小供电电压: | 3.135 V |
标称供电电压: | 3.3 V | 表面贴装: | YES |
技术: | CMOS | 端子面层: | TIN LEAD |
端子形式: | BALL | 端子节距: | 1.27 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | 30 |
宽度: | 25 mm | uPs/uCs/外围集成电路类型: | MICROPROCESSOR, RISC |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
MPC860DPZQ66D4 | FREESCALE |
获取价格 |
Hardware Specifications | |
MPC860DPZQ66D4 | NXP |
获取价格 |
PowerQUICC, 32 Bit Power Architecture SoC, 66MHz, CPM, ENET, ATM, HDLC, PCMCIA, 0 to 95C | |
MPC860DPZQ80D4 | FREESCALE |
获取价格 |
Hardware Specifications | |
MPC860DPZQ80D4 | NXP |
获取价格 |
PowerQUICC, 32 Bit Power Architecture SoC, 80MHz, CPM, ENET, ATM, HDLC, PCMCIA, 0 to 95C | |
MPC860DT | FREESCALE |
获取价格 |
Hardware Specifications | |
MPC860DT | MOTOROLA |
获取价格 |
Family Hardware Specifications | |
MPC860DTCVR50D4 | NXP |
获取价格 |
PowerQUICC, 32 Bit Power Architecture SoC, 50MHz, CPM, ENET, ATM, HDLC, PCMCIA, -40 to 95C | |
MPC860DTCVR66D4 | NXP |
获取价格 |
PowerQUICC, 32 Bit Power Architecture SoC, 66MHz, CPM, ENET, ATM, HDLC, PCMCIA, -40 to 95C | |
MPC860DTCZQ50D4 | FREESCALE |
获取价格 |
Hardware Specifications | |
MPC860DTCZQ50D4 | NXP |
获取价格 |
32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 |