是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Transferred | 零件包装代码: | BGA |
包装说明: | BGA, | 针数: | 357 |
Reach Compliance Code: | compliant | ECCN代码: | 3A991.A.2 |
HTS代码: | 8542.31.00.01 | 风险等级: | 5.16 |
地址总线宽度: | 32 | 位大小: | 32 |
边界扫描: | YES | 最大时钟频率: | 50 MHz |
外部数据总线宽度: | 32 | 格式: | FIXED POINT |
集成缓存: | YES | JESD-30 代码: | S-PBGA-B357 |
JESD-609代码: | e1 | 长度: | 25 mm |
低功率模式: | YES | 湿度敏感等级: | 3 |
端子数量: | 357 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | BGA | 封装形状: | SQUARE |
封装形式: | GRID ARRAY | 峰值回流温度(摄氏度): | 245 |
座面最大高度: | 2.52 mm | 速度: | 80 MHz |
最大供电电压: | 3.465 V | 最小供电电压: | 3.135 V |
标称供电电压: | 3.3 V | 表面贴装: | YES |
技术: | CMOS | 端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式: | BALL | 端子节距: | 1.27 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | 30 |
宽度: | 25 mm | uPs/uCs/外围集成电路类型: | MICROPROCESSOR, RISC |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
MPC860DPZQ50D4 | FREESCALE |
获取价格 |
Hardware Specifications | |
MPC860DPZQ50D4 | NXP |
获取价格 |
PowerQUICC, 32 Bit Power Architecture SoC, 50MHz, CPM, ENET, ATM, HDLC, PCMCIA, 0 to 95C | |
MPC860DPZQ50D4R2 | FREESCALE |
获取价格 |
Hardware Specifications | |
MPC860DPZQ50D4R2 | NXP |
获取价格 |
32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 | |
MPC860DPZQ66D4 | FREESCALE |
获取价格 |
Hardware Specifications | |
MPC860DPZQ66D4 | NXP |
获取价格 |
PowerQUICC, 32 Bit Power Architecture SoC, 66MHz, CPM, ENET, ATM, HDLC, PCMCIA, 0 to 95C | |
MPC860DPZQ80D4 | FREESCALE |
获取价格 |
Hardware Specifications | |
MPC860DPZQ80D4 | NXP |
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PowerQUICC, 32 Bit Power Architecture SoC, 80MHz, CPM, ENET, ATM, HDLC, PCMCIA, 0 to 95C | |
MPC860DT | FREESCALE |
获取价格 |
Hardware Specifications | |
MPC860DT | MOTOROLA |
获取价格 |
Family Hardware Specifications |