是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Transferred | 零件包装代码: | BGA |
包装说明: | 19 MM X 19 MM, 0.80 MM PITCH, LEAD FREE, PLASTIC, MAPBGA-369 | 针数: | 369 |
Reach Compliance Code: | compliant | ECCN代码: | 3A991.A.2 |
HTS代码: | 8542.31.00.01 | 风险等级: | 5.32 |
地址总线宽度: | 位大小: | 32 | |
边界扫描: | YES | 最大时钟频率: | 66.67 MHz |
外部数据总线宽度: | 格式: | FLOATING POINT | |
集成缓存: | YES | JESD-30 代码: | S-PBGA-B369 |
JESD-609代码: | e2 | 长度: | 19 mm |
低功率模式: | YES | 湿度敏感等级: | 3 |
端子数量: | 369 | 最高工作温度: | 105 °C |
最低工作温度: | 封装主体材料: | PLASTIC/EPOXY | |
封装代码: | LFBGA | 封装形状: | SQUARE |
封装形式: | GRID ARRAY, LOW PROFILE, FINE PITCH | 峰值回流温度(摄氏度): | 260 |
认证状态: | Not Qualified | 座面最大高度: | 1.61 mm |
速度: | 266 MHz | 标称供电电压: | 1 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | OTHER | 端子面层: | TIN COPPER/TIN SILVER |
端子形式: | BALL | 端子节距: | 0.8 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | 40 |
宽度: | 19 mm | uPs/uCs/外围集成电路类型: | MICROPROCESSOR, RISC |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
MPC8306S | FREESCALE |
获取价格 |
PowerQUICC II Pro Processor | |
MPC8306SCVMABDCA | NXP |
获取价格 |
PowerQUICC, Power Arch SoC, 133MHz, DDR2, HDLC, TDM, Enet, USB, -40 to 105C, Rev 1.1 | |
MPC8306SCVMACDCA | NXP |
获取价格 |
PowerQUICC, Power Arch SoC, 200MHz, DDR2, HDLC, TDM, Enet, USB, -40 to 105C, Rev 1.1 | |
MPC8306SCVMADDCA | NXP |
获取价格 |
PowerQUICC, Power Arch SoC, 266MHz, DDR2, HDLC, TDM, Enet, USB, -40 to 105C, Rev 1.1 | |
MPC8306SCVMAFDCA | NXP |
获取价格 |
PowerQUICC, Power Arch SoC, 333MHz, DDR2, HDLC, TDM, Enet, USB, -40 to 105C, Rev 1.1 | |
MPC8306SEC | FREESCALE |
获取价格 |
PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications | |
MPC8306SVMABDCA | NXP |
获取价格 |
PowerQUICC, Power Arch SoC, 133MHz, DDR2, HDLC, TDM, Enet, USB, 0 to 105C, Rev 1.1 | |
MPC8306SVMACDCA | NXP |
获取价格 |
PowerQUICC, Power Arch SoC, 200MHz, DDR2, HDLC, TDM, Enet, USB, 0 to 105C, Rev 1.1 | |
MPC8306SVMADDCA | NXP |
获取价格 |
PowerQUICC, Power Arch SoC, 266MHz, DDR2, HDLC, TDM, Enet, USB, 0 to 105C, Rev 1.1 | |
MPC8306SVMAFDCA | NXP |
获取价格 |
PowerQUICC, Power Arch SoC, 333MHz, DDR2, HDLC, TDM, Enet, USB, 0 to 105C, Rev 1.1 |