Document Number: MPC8308EC
Rev. 1, 07/2010
Freescale Semiconductor
MPC8308 PowerQUICC II Pro
Processor Hardware Specification
Contents
This document provides an overview of the MPC8308
1. Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
features and its hardware specifications, including a block
diagram showing the major functional components. The
MPC8308 is a cost-effective, low-power, highly integrated
host processor. The MPC8308 extends the PowerQUICC
family, adding higher CPU performance, additional
functionality, and faster interfaces while addressing the
requirements related to time-to-market, price, power
consumption, and package size.
2. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . 2
3. Power Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 6
4. Clock Input Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5. RESET Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . 8
6. DDR2 SDRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
7. DUART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
8. Ethernet: Three-Speed Ethernet, MII Management . 15
9. USB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
10. High-Speed Serial Interfaces (HSSI) . . . . . . . . . . . . 24
11. PCI Express . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
12. Enhanced Local Bus . . . . . . . . . . . . . . . . . . . . . . . . . 43
13. Enhanced Secure Digital Host Controller (eSDHC) . 47
14. JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
15. I2C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
16. Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
17. GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
18. IPIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
19. SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
20. Package and Pin Listings . . . . . . . . . . . . . . . . . . . . . 62
21. Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
22. Thermal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
23. System Design Information . . . . . . . . . . . . . . . . . . . 81
24. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 85
25. Document Revision History . . . . . . . . . . . . . . . . . . . 86
NOTE
The information provided in this document is
preliminary and is based on estimates only and refers to
the pre-silicon phase, with no device characterization
done. Freescale reserves the right to change the
contents of this document as appropriate.
1 Overview
Figure 1 shows the major functional units within the
MPC8308. The e300 core in the MPC8308, with its 16
Kbytes of instruction and 16 Kbytes of data cache,
implements the Power Architecture user instruction set
architecture and provides hardware and software debugging
© Freescale Semiconductor, Inc., 2010. All rights reserved.