Document Number: MPC8308EC
Freescale Semiconductor
Rev. 4, 12/2014
MPC8308 PowerQUICC II Pro
Processor Hardware Specification
Contents
This document provides an overview of the MPC8308
1. Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
features and its hardware specifications, including a block
diagram showing the major functional components. The
MPC8308 is a cost-effective, low-power, highly integrated
host processor. The MPC8308 extends the PowerQUICC
family, adding higher CPU performance, additional
functionality, and faster interfaces while addressing the
requirements related to time-to-market, price, power
consumption, and package size.
2. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . 2
3. Power characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 6
4. Clock input timing . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5. RESET initialization . . . . . . . . . . . . . . . . . . . . . . . . . . 8
6. DDR2 SDRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
7. DUART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
8. Ethernet: Three-Speed Ethernet, MII management . 15
9. USB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
10. High-Speed Serial interfaces (HSSI) . . . . . . . . . . . . 25
11. PCI Express . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
12. Enhanced Local Bus . . . . . . . . . . . . . . . . . . . . . . . . . 41
13. Enhanced Secure Digital Host Controller (eSDHC) . 44
14. JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
15. I2C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
16. Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
17. GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
18. IPIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
19. SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
20. Package and Pin Listings . . . . . . . . . . . . . . . . . . . . . 59
21. Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
22. Thermal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
23. System Design Information . . . . . . . . . . . . . . . . . . . 77
24. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 80
25. Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
© Freescale Semiconductor, Inc., 2011, 2014. All rights reserved.