是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Transferred | 零件包装代码: | BGA |
包装说明: | , | 针数: | 473 |
Reach Compliance Code: | compliant | ECCN代码: | 3A991.A.2 |
HTS代码: | 8542.31.00.01 | 风险等级: | 5.67 |
Is Samacsys: | N | JESD-30 代码: | S-PBGA-B473 |
JESD-609代码: | e2 | 湿度敏感等级: | 3 |
端子数量: | 473 | 封装主体材料: | PLASTIC/EPOXY |
封装形状: | SQUARE | 封装形式: | GRID ARRAY |
峰值回流温度(摄氏度): | 260 | 认证状态: | Not Qualified |
RAM(字节): | ROM(单词): | 0 | |
表面贴装: | YES | 技术: | CMOS |
端子面层: | TIN COPPER/TIN SILVER | 端子形式: | BALL |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | 40 |
uPs/uCs/外围集成电路类型: | MICROPROCESSOR, RISC | Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
MPC8308VMAGD | NXP |
功能相似 |
PowerQUICC, Power Architecture SoC 400MHz, DDR2, PCIe, GbE, USB, 0 to 105C, Rev 1.0 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
MPC8308ZQADDA | NXP |
获取价格 |
PowerQUICC, Power Architecture SoC 266MHz, DDR2, PCIe, GbE, USB, 0 to 105C, Rev 1.1 | |
MPC8308ZQAFDA | NXP |
获取价格 |
PowerQUICC, Power Architecture SoC 333MHz, DDR2, PCIe, GbE, USB, 0 to 105C, Rev 1.1 | |
MPC8308ZQAGDA | NXP |
获取价格 |
PowerQUICC, Power Architecture SoC 400MHz, DDR2, PCIe, GbE, USB, 0 to 105C, Rev 1.1 | |
MPC8309 | FREESCALE |
获取价格 |
PowerQUICC II Pro Processor | |
MPC8309CVMADDCA | NXP |
获取价格 |
PowerQUICC, Power Arch SoC, 266MHz, DDR2 w/ECC, PCI, HDLC, TDM, Enet, USB, CAN, -40 to 105 | |
MPC8309CVMAFDCA | NXP |
获取价格 |
32-BIT, 333MHz, RISC PROCESSOR, PBGA489, 19 X 19 MM, 1.61 MM HEIGHT, 0.80 MM PITCH, LEAD F | |
MPC8309CVMAGDCA | NXP |
获取价格 |
32-BIT, 400MHz, RISC PROCESSOR, PBGA489, 19 X 19 MM, 1.61 MM HEIGHT, 0.80 MM PITCH, LEAD F | |
MPC8309CVMAHFCA | NXP |
获取价格 |
32-BIT, 417MHz, RISC PROCESSOR, PBGA489, 19 X 19 MM, 1.61 MM HEIGHT, 0.80 MM PITCH, LEAD F | |
MPC8309EC | FREESCALE |
获取价格 |
PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications | |
MPC8309VMADDCA | NXP |
获取价格 |
PowerQUICC, Power Arch SoC, 266MHz, DDR2 w/ECC, PCI, HDLC, TDM, Enet, USB, CAN, 0 to 105C, |