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MPC8306VMACDCA

更新时间: 2024-11-08 14:59:27
品牌 Logo 应用领域
恩智浦 - NXP 双倍数据速率
页数 文件大小 规格书
75页 781K
描述
PowerQUICC, Power Arch SoC, 200MHz, DDR2, HDLC, TDM, Enet, USB, CAN, 0 to 105C, Rev 1.1

MPC8306VMACDCA 数据手册

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Document Number:MPC8306EC  
Rev. 3,12/2014  
Freescale Semiconductor  
Technical Data  
MPC8306  
PowerQUICC II Pro Integrated  
Communications Processor  
Family Hardware Specifications  
Contents  
This document provides an overview of the MPC8306  
1. Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
PowerQUICC II Pro processor features. The MPC8306 is a  
cost-effective, highly integrated communications processor  
that addresses the requirements of several networking  
applications, including residential gateways,  
modem/routers, industrial control, and test and measurement  
applications. The MPC8306 extends current PowerQUICC  
offerings, adding higher CPU performance, additional  
functionality, and faster interfaces, while addressing the  
requirements related to time-to-market, price, power  
consumption, and board real estate. This document describes  
the electrical characteristics of MPC8306.  
2. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . 7  
3. Power Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 10  
4. Clock Input Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
5. RESET Initialization . . . . . . . . . . . . . . . . . . . . . . . . . 12  
6. DDR2 SDRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
7. Local Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
8. Ethernet and MII Management . . . . . . . . . . . . . . . . . 21  
9. TDM/SI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29  
10. HDLC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30  
11. USB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33  
12. DUART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35  
13. eSDHC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36  
14. FlexCAN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38  
15. I2C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39  
16. Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41  
17. GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42  
18. IPIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43  
19. SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43  
20. JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45  
21. Package and Pin Listings . . . . . . . . . . . . . . . . . . . . . 49  
22. Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59  
23. Thermal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66  
24. System Design Information . . . . . . . . . . . . . . . . . . . 69  
25. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 72  
26. Document Revision History . . . . . . . . . . . . . . . . . . . 74  
To locate published errata or updates for this document, refer  
to the MPC8306 product summary page on our website  
listed on the back cover of this document or contact your  
local Freescale sales office.  
© 2011, 2014 Freescale Semiconductor, Inc. All rights reserved.  

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