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MPC8250ACZUMHBC PDF预览

MPC8250ACZUMHBC

更新时间: 2024-11-30 21:17:31
品牌 Logo 应用领域
摩托罗拉 - MOTOROLA 外围集成电路
页数 文件大小 规格书
73页 835K
描述
RISC Microprocessor, 32-Bit, 266MHz, CMOS, PBGA480, 37 X 37 MM, 1.70 MM HEIGHT, 1.27 MM PITCH, TBGA-480

MPC8250ACZUMHBC 技术参数

生命周期:Transferred零件包装代码:BGA
包装说明:LBGA,针数:480
Reach Compliance Code:unknown风险等级:5.43
其他特性:REQUIRES 3.3V SUPPLY FOR I/O地址总线宽度:32
位大小:32边界扫描:YES
外部数据总线宽度:64格式:FLOATING POINT
集成缓存:YESJESD-30 代码:S-PBGA-B480
长度:37.5 mm低功率模式:NO
端子数量:480封装主体材料:PLASTIC/EPOXY
封装代码:LBGA封装形状:SQUARE
封装形式:GRID ARRAY, LOW PROFILE认证状态:Not Qualified
座面最大高度:1.65 mm速度:266 MHz
最大供电电压:2.2 V最小供电电压:1.9 V
标称供电电压:2 V表面贴装:YES
技术:CMOS端子形式:BALL
端子节距:1.27 mm端子位置:BOTTOM
宽度:37.5 mmuPs/uCs/外围集成电路类型:MICROPROCESSOR, RISC
Base Number Matches:1

MPC8250ACZUMHBC 数据手册

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Technical Data  
MPC8250EC/D  
Rev.0.9 8/2003  
MPC8250  
Hardware Specications  
This document contains detailed information on power considerations, DC/AC electrical  
characteristics, and AC timing specifications for the MPC8250 PowerQUICC II™  
communications processor.  
The following topics are addressed:  
Topic  
Page  
2
Section 1.1, “Features”  
Section 1.2, “Electrical and Thermal Characteristics”  
Section 1.2.1, “DC Electrical Characteristics”  
Section 1.2.2, “Thermal Characteristics”  
Section 1.2.3, “Power Considerations”  
Section 1.2.4, “AC Electrical Characteristics”  
Section 1.3, “Clock Configuration Modes”  
Section 1.3.1, “Local Bus Mode”  
Section 1.3.2, “PCI Mode”  
5
5
10  
10  
11  
19  
19  
22  
28  
53  
56  
Section 1.4, “Pinout”  
Section 1.5, “Package Description”  
Section 1.6, “Ordering Information”  
The MPC8250 is available in two packages—the standard ZU package (480 TBGA) and an  
alternate VR package (516 PBGA)—as described in Section 1.4, “Pinout,” and Section 1.5,  
“Package Description.” For more information on VR packages, contact your Motorola sales  
office. Note that throughout this document references to the MPC8250 are inclusive of its VR  
version unless otherwise specified.  
NOTE: Document Revision History  
Changes to this document are summarized in Table 23 on  
page 56.  

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