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MPC8250AVRIHBC PDF预览

MPC8250AVRIHBC

更新时间: 2024-11-30 14:38:19
品牌 Logo 应用领域
恩智浦 - NXP 外围集成电路
页数 文件大小 规格书
62页 1122K
描述
32-BIT, 200MHz, RISC PROCESSOR, PBGA516, 27 X 27 MM, PLASTIC, BGA-516

MPC8250AVRIHBC 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:Transferred零件包装代码:BGA
包装说明:27 X 27 MM, PLASTIC, BGA-516针数:516
Reach Compliance Code:compliantECCN代码:3A991.A.2
HTS代码:8542.31.00.01风险等级:8.2
Is Samacsys:N地址总线宽度:32
位大小:32边界扫描:YES
外部数据总线宽度:64格式:FLOATING POINT
集成缓存:YESJESD-30 代码:S-PBGA-B516
JESD-609代码:e1长度:27 mm
湿度敏感等级:3端子数量:516
最高工作温度:70 °C最低工作温度:
封装主体材料:PLASTIC/EPOXY封装代码:BGA
封装等效代码:BGA516,26X26,40封装形状:SQUARE
封装形式:GRID ARRAY峰值回流温度(摄氏度):245
电源:1.7/2.2 V认证状态:Not Qualified
座面最大高度:2.55 mm速度:200 MHz
子类别:Other uPs/uCs/Peripheral ICs最大供电电压:1.9 V
最小供电电压:1.7 V标称供电电压:1.8 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:Tin/Silver/Copper (Sn/Ag/Cu)
端子形式:BALL端子节距:1 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:30
宽度:27 mmuPs/uCs/外围集成电路类型:MICROPROCESSOR, RISC
Base Number Matches:1

MPC8250AVRIHBC 数据手册

 浏览型号MPC8250AVRIHBC的Datasheet PDF文件第2页浏览型号MPC8250AVRIHBC的Datasheet PDF文件第3页浏览型号MPC8250AVRIHBC的Datasheet PDF文件第4页浏览型号MPC8250AVRIHBC的Datasheet PDF文件第5页浏览型号MPC8250AVRIHBC的Datasheet PDF文件第6页浏览型号MPC8250AVRIHBC的Datasheet PDF文件第7页 
Document Number: MPC8250EC  
Rev. 2, 07/2009  
Freescale Semiconductor  
MPC8250  
Hardware Specifications  
Contents  
This document contains detailed information on power  
1. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
2. Electrical and Thermal Characteristics . . . . . . . . . . . . 6  
3. Clock Configuration Modes . . . . . . . . . . . . . . . . . . . 20  
4. Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29  
5. Package Description . . . . . . . . . . . . . . . . . . . . . . . . . 55  
6. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 59  
7. Document Revision History . . . . . . . . . . . . . . . . . . . 59  
considerations, DC/AC electrical characteristics, and AC  
timing specifications for the MPC8250 PowerQUICC II™  
communications processor.  
The following topics are addressed:  
The MPC8250 is available in two packages—the standard  
TBGA package (480 pins) and an alternate PBGA package  
(516 pins)—as described in Section 4, “Pinout,” and  
Section 5, “Package Description.” For more information on  
PBGA packages, contact your Freescale sales office. Note  
that throughout this document references to the MPC8250  
are inclusive of its PBGA version unless otherwise specified.  
This document contains information on a new product. Specifications and information herein  
are subject to change without notice.  
© Freescale Semiconductor, Inc., 2003, 2005, 2009. All rights reserved.  

MPC8250AVRIHBC 替代型号

型号 品牌 替代类型 描述 数据表
MPC8321EVRADDCA NXP

完全替代

32-BIT, 266MHz, RISC PROCESSOR, PBGA516, 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, LEAD FREE
MPC8321EVRAFDCA NXP

完全替代

PowerQUICC, 32 Bit Power Architecture SoC, 333MHz e300, QE, PCI, USB2.0, DDR1/2, SEC, 0-10
MPC8270VRMIBA NXP

类似代替

PowerQUICC, 32 Bit Power Architecture, 266MHz, Comms Processor, PCI, USB, HDLC, Enet, 0 to

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