Datasheet > MMBZ52XXELT1G

MMBZ52XXELT1G

更新时间： 2024-11-08 05:08:27

品牌	Logo	应用领域
安森美 - ONSEMI		稳压器
页数	文件大小	规格书
6页	74K
描述
Zener Voltage Regulators 225 mW SOT−23 Surface Mount

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中文翻译

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MMBZ52XXELT1G 数据手册

MMBZ5221ELT1 Series

Preferred Device

Zener Voltage Regulators

225 mW SOT−23 Surface Mount

This series of Zener diodes is offered in the convenient, surface

mount plastic SOT−23 package. These devices are designed to provide

voltage regulation with minimum space requirement. They are well

suited for applications such as cellular phones, hand held portables,

and high density PC boards.

http://onsemi.com

Features

Cathode

Anode

• 225 mW Rating on FR−4 or FR−5 Board

• Zener Voltage Range − 2.4 V to 91 V

MARKING

DIAGRAM

• Package Designed for Optimal Automated Board Assembly

• Small Package Size for High Density Applications

• ESD Rating of Class 3 (>16 kV) per Human Body Model

• Peak Power − 225 W (8 x 20 ms)

SOT−23

CASE 318

STYLE 8

Bxx M G

• Pb−Free Packages are Available

Mechanical Characteristics:

CASE: Void-free, transfer-molded, thermosetting plastic case

FINISH: Corrosion resistant finish, easily solderable

MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:

260°C for 10 Seconds

POLARITY: Cathode indicated by polarity band

FLAMMABILITY RATING: UL 94 V−0

Bxx = Device Code

= (Refer to page 2)

= Date Code*

= Pb−Free Package

(Note: Microdot may be in either location)

*Date Code orientation may vary depending

upon manufacturing location.

MAXIMUM RATINGS

Rating

Symbol

Max

Unit

ORDERING INFORMATION

Peak Power Dissipation @ 20 ms (Note 1)

225

†

Device

MMBZ52xxELT1

Package

Shipping

@ T ≤ 25°C

SOT−23 3000/Tape & Reel

Total Power Dissipation on FR−5 Board,

(Note 2) @ T = 25°C

Derated above 25°C

225

1.8

mW/°C

MMBZ52xxELT1G SOT−23 3000/Tape & Reel

(Pb−Free)

Thermal Resistance, Junction−to−Ambient

556

°C/W

MMBZ52xxELT3

SOT−23 10000/Tape & Reel

Total Power Dissipation on Alumina

MMBZ52xxELT3G SOT−23 10000/Tape & Reel

(Pb−Free)

Substrate, (Note 3) @ T = 25°C

300

2.4

mW/°C

Derated above 25°C

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

Thermal Resistance, Junction−to−Ambient

Junction and Storage Temperature Range

417

°C/W

°C

T , T

−65 to

+150

stg

Maximum ratings are those values beyond which device damage can occur.

Maximum ratings applied to the device are individual stress limit values (not

normal operating conditions) and are not valid simultaneously. If these limits are

exceeded, device functional operation is not implied, damage may occur and

reliability may be affected.

DEVICE MARKING INFORMATION

See specific marking information in the device marking

column of the Electrical Characteristics table on page 2 of

this data sheet.

1. Nonrepetitive current pulse per Figure 9.

2. FR−5 = 1.0 X 0.75 X 0.62 in.

3. Alumina = 0.4 X 0.3 X 0.024 in., 99.5% alumina.

Devices listed in bold, italic are ON Semiconductor

Preferred devices. Preferred devices are recommended

choices for future use and best overall value.

Semiconductor Components Industries, LLC, 2005

Publication Order Number:

August, 2005 − Rev. 6

MMBZ5221ELT1/D

12 3 4 5 6

中文翻译

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