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MMBT2369LT1_07 PDF预览

MMBT2369LT1_07

更新时间: 2024-02-13 18:59:41
品牌 Logo 应用领域
安森美 - ONSEMI 晶体开关晶体管
页数 文件大小 规格书
6页 88K
描述
Switching Transistors NPN Silicon

MMBT2369LT1_07 数据手册

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MMBT2369LT1,  
MMBT2369ALT1  
MMBT2369ALT1 is a Preferred Device  
Switching Transistors  
NPN Silicon  
http://onsemi.com  
Features  
Pb−Free Packages are Available  
COLLECTOR  
3
MAXIMUM RATINGS  
Rating  
CollectorEmitter Voltage  
CollectorEmitter Voltage  
CollectorBase Voltage  
EmitterBase Voltage  
Symbol  
Value  
15  
Unit  
Vdc  
1
BASE  
V
CEO  
V
40  
Vdc  
2
CES  
CBO  
EBO  
EMITTER  
V
V
40  
Vdc  
4.5  
200  
Vdc  
3
Collector Current − Continuous  
I
mAdc  
C
SOT−23  
CASE 318  
STYLE 6  
THERMAL CHARACTERISTICS  
1
Characteristic  
Symbol  
Max  
Unit  
2
Total Device Dissipation FR5 Board  
P
D
(Note 1) T = 25°C  
225  
1.8  
mW  
mW/°C  
A
Derate above 25°C  
MARKING DIAGRAMS  
Thermal Resistance, Junction−to−Ambient  
R
q
JA  
556  
°C/W  
Total Device Dissipation Alumina  
P
D
Substrate, (Note 2) T = 25°C  
300  
2.4  
mW  
mW/°C  
A
Derate above 25°C  
xxx M G  
G
Thermal Resistance, Junction−to−Ambient  
Junction and Storage Temperature  
R
417  
°C/W  
°C  
q
JA  
1
T , T  
J
−55 to +150  
stg  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. FR5 = 1.0 0.75 0.062 in.  
xxx = M1J or 1JA  
M
= Date Code*  
G
= Pb−Free Package  
(Note: Microdot may be in either location)  
2. Alumina = 0.4 0.3 0.024 in. 99.5% alumina.  
*Date Code orientation and/or overbar may  
vary depending upon manufacturing location.  
ORDERING INFORMATION  
Device  
Package  
Shipping  
MMBT2369LT1  
SOT−23 3000/Tape & Reel  
MMBT2369LT1G  
SOT−23 3000/Tape & Reel  
(Pb−Free)  
MMBT2369ALT1  
SOT−23 3000/Tape & Reel  
MMBT2369ALT1G SOT−23 3000/Tape & Reel  
(Pb−Free)  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
Preferred devices are recommended choices for future use  
and best overall value.  
©
Semiconductor Components Industries, LLC, 2007  
1
Publication Order Number:  
January, 2007 − Rev. 5  
MMBT2369LT1/D  
 

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