SPECIFICATION FOR APPROVAL
REF : 20100428-B
PROD.
PAGE: 1
ABC'S DWG NO.
ABC'S ITEM NO.
MH1608□□□□L□-□□□
MULTILAYER CHIP INDUCTOR
NAME
Ⅰ﹒CONFIGURATION & DIMENSIONS:
A
A
B
C
D
:
1.60±0.15
m/m
m/m
m/m
m/m
:
0.80±0.15
0.80±0.15
0.30±0.20
:
:
D
Ⅱ﹒SCHEMATIC DIAGRAM:
Ⅲ﹒FEATURES:
a﹒Monolithic structure ensuring high performance and reliability.
b﹒High frequency applications up to 6GHz.
c﹒Terminal:Ag/Cu/Ni/Sn
d﹒Remark:Products comply with RoHS' requirements
Ⅳ﹒APPLICATIONS:
a﹒RF modules for telecommunication systems including
GSM, PCS,DECT,WLAN,Bluetooth,etc.
Ⅴ﹒GENERAL SPECIFICATION:
Peak Temp:260℃ max.
a﹒Storage Conditions:
Max time above 230℃ :50sec max.
Max time above 200℃ :70sec max.
Temperature
Electrical Performance temp:-55℃ ~ +125℃
Terminal Solderability & Packages Material temp:
-10℃ ~ +40℃ and RH 70% max.
Rising Area
Preheat Area
Reflow Area
Forced Cooling Area
+2.0 ~ 4.0℃
/ sec max.
+4.0℃ / sec max.
150 ~ 200℃ / 60 ~ 120sec
-(1.0 ~ 5.0)℃ / sec max.
Peak Temperature:
260℃
b﹒Operating temp.:-55℃ ---- +125℃
c﹒Solderability:
250
230℃
50sec max.
200
150
100
50
Solder : Sn96.5 / Ag3 / Cu0.5
70sec max.
or equivalent
Solder temp. : 260±5℃
Flux : Rosin
Dip time : 4±1 seconds
50
100
150
Time ( seconds )
200
250
0
AR-001A