Datasheet > MH16083N3D2

MH16083N3D2

更新时间： 2024-11-24 11:02:03

品牌	Logo	应用领域
ABC		电感器
页数	文件大小	规格书
6页	153K
描述
MULTILAYER CHIP INDUCTOR

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数据手册

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MH16083N3D2 数据手册

SPECIFICATION FOR APPROVAL

REF :

PROD.

NAME

PAGE: 1

ABC'S DWG NO.

ABC'S ITEM NO.

MH1608□□□□2□-□□□

MULTILAYER CHIP INDUCTOR

Ⅰ﹒CONFIGURATION & DIMENSIONS：

1.60±0.15

0.80±0.15

0.40±0.20

m/m

Ⅱ﹒SCHEMATIC DIAGRAM：

Ⅲ﹒FEATURES：

a﹒Monolithic structure ensuring high performance and reliability.

b﹒High frequency applications up to 6GHz.

c﹒Terminal：Ag/Cu/Ni/Sn

d﹒Remark：Products comply with RoHS' requirements

Ⅳ﹒APPLICATIONS：

a﹒RF modules for telecommunication systems including

GSM, PCS,DECT,WLAN,Bluetooth,etc.

Peak Temp：260℃ max.

Max time above 230℃ ：50sec max.

Max time above 200℃ ：70sec max.

Temperature

Ⅴ﹒GENERAL SPECIFICATION：

a﹒Storage temp.：-55℃---- +125℃

b﹒Operating temp.：-55℃ ---- +125℃

Rising Area

Preheat Area

Reflow Area

Forced Cooling Area

+2.0 ~ 4.0℃

/ sec max.

+4.0℃ / sec max.

150 ~ 200℃ / 60 ~ 120sec

-(1.0 ~ 5.0)℃ / sec max.

Peak Temperature:

260℃

250

200

150

100

230℃

50sec max.

c﹒Solderability：Preheat 150℃. 60 sec

Solder：H63A

Solder temp.：230±5℃

Flux：Rosin

70sec max.

Dip time：4±1 sec

100

150

Time ( seconds )

200

250

AR-001A

12 3 4 5 6

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