Datasheet > MH16083N3DLB

MH16083N3DLB

更新时间： 2024-11-25 09:31:47

品牌	Logo	应用领域
ABC		/
页数	文件大小	规格书
6页	100K
描述
General Purpose Inductor, 0.0033uH, 0603,

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数据手册

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MH16083N3DLB 数据手册

SPECIFICATION FOR APPROVAL

REF : 20100428-B

PROD.

PAGE: 1

ABC'S DWG NO.

ABC'S ITEM NO.

MH1608□□□□L□-□□□

MULTILAYER CHIP INDUCTOR

NAME

Ⅰ﹒CONFIGURATION & DIMENSIONS：

1.60±0.15

m/m

0.80±0.15

0.30±0.20

Ⅱ﹒SCHEMATIC DIAGRAM：

Ⅲ﹒FEATURES：

a﹒Monolithic structure ensuring high performance and reliability.

b﹒High frequency applications up to 6GHz.

c﹒Terminal：Ag/Cu/Ni/Sn

d﹒Remark：Products comply with RoHS' requirements

Ⅳ﹒APPLICATIONS：

a﹒RF modules for telecommunication systems including

GSM, PCS,DECT,WLAN,Bluetooth,etc.

Ⅴ﹒GENERAL SPECIFICATION：

Peak Temp：260℃ max.

a﹒Storage Conditions：

Max time above 230℃ ：50sec max.

Max time above 200℃ ：70sec max.

Temperature

Electrical Performance temp：-55℃ ~ +125℃

Terminal Solderability & Packages Material temp：

-10℃ ~ +40℃ and RH 70% max.

Rising Area

Preheat Area

Reflow Area

Forced Cooling Area

+2.0 ~ 4.0℃

/ sec max.

+4.0℃ / sec max.

150 ~ 200℃ / 60 ~ 120sec

-(1.0 ~ 5.0)℃ / sec max.

Peak Temperature:

260℃

b﹒Operating temp.：-55℃ ---- +125℃

c﹒Solderability：

250

230℃

50sec max.

200

150

100

Solder : Sn96.5 / Ag3 / Cu0.5

70sec max.

or equivalent

Solder temp. : 260±5℃

Flux : Rosin

Dip time : 4±1 seconds

100

150

Time ( seconds )

200

250

AR-001A

12 3 4 5 6

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