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MH16082N2DLA PDF预览

MH16082N2DLA

更新时间: 2024-11-25 04:47:27
品牌 Logo 应用领域
ABC /
页数 文件大小 规格书
6页 100K
描述
General Purpose Inductor, 0.0022uH, 0603,

MH16082N2DLA 数据手册

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SPECIFICATION FOR APPROVAL  
REF : 20100428-B  
PROD.  
PAGE: 1  
ABC'S DWG NO.  
ABC'S ITEM NO.  
MH1608□□□□L-□□□  
MULTILAYER CHIP INDUCTOR  
NAME  
Ⅰ﹒CONFIGURATION & DIMENSIONS:  
A
A
B
C
D
:
1.60±0.15  
m/m  
m/m  
m/m  
m/m  
:
0.80±0.15  
0.80±0.15  
0.30±0.20  
:
:
D
Ⅱ﹒SCHEMATIC DIAGRAM:  
Ⅲ﹒FEATURES:  
aMonolithic structure ensuring high performance and reliability.  
bHigh frequency applications up to 6GHz.  
cTerminalAg/Cu/Ni/Sn  
dRemarkProducts comply with RoHS' requirements  
Ⅳ﹒APPLICATIONS:  
aRF modules for telecommunication systems including  
GSM, PCS,DECT,WLAN,Bluetooth,etc.  
Ⅴ﹒GENERAL SPECIFICATION:  
Peak Temp260max.  
aStorage Conditions:  
Max time above 230℃ :50sec max.  
Max time above 200℃ :70sec max.  
Temperature  
Electrical Performance temp-55~ +125℃  
Terminal Solderability & Packages Material temp:  
-10~ +40and RH 70% max.  
Rising Area  
Preheat Area  
Reflow Area  
Forced Cooling Area  
+2.0 ~ 4.0  
/ sec max.  
+4.0/ sec max.  
150 ~ 200/ 60 ~ 120sec  
-(1.0 ~ 5.0)/ sec max.  
Peak Temperature:  
260  
bOperating temp.-55---- +125℃  
cSolderability:  
250  
230℃  
50sec max.  
200  
150  
100  
50  
Solder : Sn96.5 / Ag3 / Cu0.5  
70sec max.  
or equivalent  
Solder temp. : 260±5℃  
Flux : Rosin  
Dip time : 4±1 seconds  
50  
100  
150  
Time ( seconds )  
200  
250  
0
AR-001A  

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