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MH16082N2DL PDF预览

MH16082N2DL

更新时间: 2024-11-24 11:02:03
品牌 Logo 应用领域
ABC 电感器
页数 文件大小 规格书
5页 377K
描述
MULTILAYER CHIP INDUCTOR

MH16082N2DL 数据手册

 浏览型号MH16082N2DL的Datasheet PDF文件第2页浏览型号MH16082N2DL的Datasheet PDF文件第3页浏览型号MH16082N2DL的Datasheet PDF文件第4页浏览型号MH16082N2DL的Datasheet PDF文件第5页 
SPECIFICATION FOR APPROVAL  
REF :  
PROD.  
NAME  
PAGE: 1  
MH1608□□□□L-□□□  
ABC'S DWG NO.  
ABC'S ITEM NO.  
MULTILAYER CHIP INDUCTOR  
CONFIGURATION & DIMENSIONS:  
A
A
:
1.60±0.15  
m/m  
B
C
D
:
:
:
0.80±0.15  
0.80±0.15  
0.30±0.20  
m/m  
m/m  
m/m  
D
SCHEMATIC DIAGRAM:  
FEATURES:  
a
Monolithic structure ensuring high performance and reliability.  
b
High frequency applications up to 6GHz.  
c
TerminalAg/Cu/Ni/Sn  
d
RemarkProducts comply with RoHS' requirements  
APPLICATIONS:  
a
RF modules for telecommunication systems including  
GSM, PCS,DECT,WLAN,Bluetooth,etc.  
Peak Temp260max.  
Max time above 230℃ :50sec max.  
Max time above 200℃ :70sec max.  
Temperature  
GENERAL SPECIFICATION:  
Rising Area  
Preheat Area  
Reflow Area  
Forced Cooling Area  
+2.0 ~ 4.0  
a
Storage temp.-55---- +125℃  
+4.0/ sec max.  
150 ~ 200/ 60 ~ 120sec  
-(1.0 ~ 5.0)/ sec max.  
/ sec max.  
Peak Temperature:  
b
Operating temp.-55---- +125℃  
260  
250  
200  
150  
100  
50  
230℃  
50sec max.  
c
SolderabilityPreheat 150. 60 sec  
SolderH63A  
Solder temp.230±5℃  
FluxRosin  
Dip time4±1 sec  
70sec max.  
0
50  
100  
150  
Time ( seconds )  
200  
250  
AR-001A  

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