F-214
MEC1–130–02–L–D–EM2
MEC1–120–02–F–D–EM2
MEC1–120–02–L–D–RA1–SL
(1,00 mm) .0394"
MEC1-RA, MEC1-EM SERIES
RIGHT ANGLE/EDGE MOUNT SOCKETS
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?MEC1-RA
CARD
SLOT
PLATING
OPTION
POSITIONS
PER ROW
1
MEC1
D
RA1
NP
SL
Insulator Material:
Black LCP
Mates with:
(1,60 mm)
.062" card
–F
–02
= (1,60 mm)
.062"
POSITIONS POLARIZED
Contact Material:
Phosphor Bronze
Plating: Au or Sn over
50µ" (1,27 µm) Ni
Current Rating:
= Gold flash
on contact,
Matte Tin
on tail
PER ROW
POSITIONS
3, 4
–NP
05, 08, 20, 30,
40, 50, 60, 70
05
08
20
30
40
50
60
70
= No Polarization
(8 positions only)
thick card
5, 6
15, 16
21, 22
31, 32
Leave Blank for
polarization
1.6 A per pin
(2 adjacent pins powered)
Operating Temp Range:
-55°C to +125°C
–L
= 10µ"
(11,68)
.460
(11,94)
.470
41, 42
(0,25 µm)
Gold on
contact,
Matte Tin
on tail
ALSO
Insertion Depth:
(5,84 mm) .230" to
(8,13 mm) .320"
(8,89)
.350
31, 32, 63 & 64
53, 54, 115 & 116
AVAILABLE
(MOQ Required)
RoHS Compliant: Yes
Note: While optimized for 50Ω
applications, this connector
with alternative signal/ground
patterns may also perform well in
certain 75Ω applications. Contact
Samtec for further information.
(No. of Positions + 2) x
(1,00) .03937 + (2,54) .100
• Elevated body
height
• Other platings
Contact Samtec.
Processing:
Lead–Free Solderable: Yes
SMT Lead Coplanarity:
(0,10 mm) .004" max (05-40)
(0,15 mm) .006" max (50-70)
(8,13)
.320
(0,36) .014
02
(6,81)
.268
(0,64)
.025
MEC1-RA
Rated @ 3dB Insertion Loss*
RECOGNITIONS
01
(1,00)
.03937
6,81 mm Stack Height
Single-Ended Signaling
Differential Pair Signaling
(1,78)
.070
DIA
(1,27)
.050
(3,12) .123
(2,51)
.099
4.5 GHz / 9 Gbps
5.5 GHz / 11 Gbps
(1,24)
.049
For complete scope of
recognitions see
www.samtec.com/quality
(No. of Positions + 2)
x (1,00) .03937
*Performance data includes effects of a non-optimized PCB.
Note: Some sizes, styles and
options are non-standard,
non-returnable.
Complete test data available at www.samtec.com?MEC1-RA
or contact sig@samtec.com
APPLICATION
Samtec recommends that pads
on the mating board be Gold plated.
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?MEC1-EM
PLATING
OPTION
POSITIONS
PER ROW
1
EM2
NP
MEC1
02
D
Insulator Material:
Black LCP
Contact Material:
Phosphor Bronze
Plating:
Mates with:
(1,60 mm)
.062" card
–NP
–F
05, 08, 20, 30,
40, 50, 60, 70
= No Polarization
(8 positions only)
= Gold flash on contact,
Matte Tin on tail
Au or Sn over
50µ" (1,27 µm) Ni
Current Rating:
1.8 A per pin
ALSO
Leave Blank for
polarization
AVAILABLE
(No. of Positions + 2) x
–L
(2 adjacent pins powered)
Operating
(1,00) .03937 + (12,45) .490
(MOQ Required)
= 10µ" (0,25 µm) Gold on contact,
Matte Tin on tail
02
Temp Range:
-55°C to +125°C
Insertion Depth:
(5,84 mm) .230" to
(8,13 mm) .320"
RoHS Compliant:
Yes
• Edge mount leads
for (0,80 mm) .031"
thick board
• Other platings
Contact Samtec.
(6,81)
.268
POSITIONS POLARIZED
PER ROW POSITIONS
Note: While optimized for 50Ω applications,
this connector with alternative signal/ground
patterns may also perform well in certain
75Ω applications. Contact Samtec for
further information.
01
05
08
20
30
40
50
3, 4
(No. of Positions + 2)
x (1,00) .03937
5, 6
15, 16
21, 22
31, 32
41, 42
Lead–Free Solderable:
Yes
(8,13)
.320
(8,89)
.350
RECOGNITIONS
31, 32, 63
& 64
53, 54, 115
& 116
For complete scope of
recognitions see
www.samtec.com/quality
60
70
(4,70)
.185
(5,21)
.205
Note: Some sizes,
styles and options
are non-standard,
non-returnable.
(1,19) (0,38)
(3,15)
.124
(4,57)
.180
(0,36)
.014
.047
.015
(1,00)
.03937
WWW.SAMTEC.COM
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