F-219
MEC1–130–02–L–D–EM2
MEC1–120–02–F–D–EM2
MEC1–120–02–L–D–RA1–SL
(1.00 mm) .0394"
MEC1-RA, MEC1-EM SERIES
RIGHT-ANGLE/EDGE MOUNT SOCKETS
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?MEC1-RA
CARD
SLOT
PLATING
OPTION
POSITIONS
PER ROW
1
MEC1
D
RA1
NP
SL
Insulator Material: Black LCP
Contact Material:
Mates with:
(1.60 mm)
.062" card
POSITIONS POLARIZED
–F
–02
= (1.60 mm)
.062"
Phosphor Bronze
PER ROW
POSITIONS
3, 4
= Gold flash
on contact,
Matte Tin
on tail
–NP
Plating: Au or Sn over
50 µ" (1.27 µm) Ni
Current Rating: 1.6 A per pin
(2 adjacent pins powered)
Operating Temp Range:
-55 °C to +125 °C
Insertion Depth:
(5.84 mm) .230" to (8.13 mm) .320"
RoHS Compliant: Yes
05, 08, 20, 30,
40, 50, 60, 70
05
08
20
30
40
50
60
70
= No Polarization
(8 positions only)
thick card
5, 6
15, 16
21, 22
31, 32
Leave Blank for
polarization
–L
= 10 µ"
41, 42
(0.25 µm)
Gold on
contact,
Matte Tin
on tail
(11.68)
.460
(11.96)
.471
31, 32, 63 & 64
53, 54, 115 & 116
(8.89)
.350
PROCESSING
ALSO
AVAILABLE
(MOQ Required)
Note: While optimized for 50 W
applications, this connector with
alternative signal/ground patterns
may also perform well in certain
75 W applications.
Lead–Free Solderable: Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (05-40)
(0.15 mm) .006" max (50-70)*
*(.004" stencil solution
may be available; contact
IPG@samtec.com)
(No. of Positions + 2) x
(1.00) .03937 + (2.54) .100
(8.13)
.320
• Elevated body
height
(0.36) .014
02
• Other platings
(6.81)
.268
(0.91)
.036
01
(1.00)
.03937
RECOGNITIONS
(1.78)
.070
DIA
HIGH-SPEED CHANNEL PERFORMANCE
(0.91)
.036
(2.51)
.099
(1.52)
.060
(No. of Positions + 2)
For complete scope of
recognitions see
www.samtec.com/quality
MEC1-RA
x (1.00) .03937
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
Note: Some sizes, styles and
options are non-standard,
non-returnable.
14
or contact SIG@samtec.com
G
b p s
FILE NO. E111594
APPLICATION
Samtec recommends that pads
on the mating board be Gold plated.
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?MEC1-EM
PLATING
OPTION
POSITIONS
PER ROW
1
EM2
NP
MEC1
02
D
Insulator Material:
Black LCP
Mates with:
(1.60 mm)
.062" card
Contact Material:
Phosphor Bronze
Plating:
–NP
–F
05, 08, 20, 30,
40, 50, 60, 70
= No Polarization
(8 positions only)
= Gold flash on contact,
Matte Tin on tail
Au or Sn over
50 µ" (1.27 µm) Ni
Current Rating:
1.8 A per pin
Leave Blank for
polarization
ALSO
(No. of Positions + 2) x
–L
(2 adjacent pins powered)
AVAILABLE
(1.00) .03937 + (12.45) .490
= 10 µ" (0.25 µm) Gold on contact,
Matte Tin on tail
Operating
02
(MOQ Required)
Temp Range:
-55 °C to +125 °C
Insertion Depth:
(5.84 mm) .230" to
(8.13 mm) .320"
RoHS Compliant:
Yes
• Edge mount leads
for (0.80 mm) .031"
thick board
(6.81)
.268
POSITIONS POLARIZED
PER ROW POSITIONS
Note: While optimized for 50 W applications,
this connector with alternative signal/ground
patterns may also perform well in certain
75 W applications.
01
05
08
20
30
40
50
3, 4
• Other platings
(No. of Positions + 2)
x (1.00) .03937
5, 6
15, 16
21, 22
31, 32
41, 42
Lead–Free Solderable:
Yes
(8.13)
(8.89)
.350
.320
RECOGNITIONS
31, 32, 63
& 64
53, 54, 115
& 116
For complete scope of
recognitions see
60
70
(4.70)
.185
(5.21)
.205
www.samtec.com/quality
Note: Some sizes,
(1.19) (0.38)
styles and options
are non-standard,
non-returnable.
(3.15)
.124
(4.57)
.180
(0.36)
.014
.047
.015
(1.00)
.03937
FILE NO. E111594
Due to technical progress, all designs, specifications and components are subject to change without notice.
WWW.SAMTEC.COM
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.