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MCM63P737ZP133R PDF预览

MCM63P737ZP133R

更新时间: 2024-10-03 05:15:31
品牌 Logo 应用领域
摩托罗拉 - MOTOROLA 时钟静态存储器内存集成电路
页数 文件大小 规格书
21页 320K
描述
Cache SRAM, 128KX36, 4ns, CMOS, PBGA119, PLASTIC, BGA-119

MCM63P737ZP133R 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:BGA包装说明:BGA,
针数:119Reach Compliance Code:unknown
ECCN代码:3A991.B.2.AHTS代码:8542.32.00.41
风险等级:5.86最长访问时间:4 ns
其他特性:PIPELINED ARCHITECTUREJESD-30 代码:R-PBGA-B119
JESD-609代码:e0长度:22 mm
内存密度:4718592 bit内存集成电路类型:CACHE SRAM
内存宽度:36功能数量:1
端子数量:119字数:131072 words
字数代码:128000工作模式:SYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:128KX36封装主体材料:PLASTIC/EPOXY
封装代码:BGA封装形状:RECTANGULAR
封装形式:GRID ARRAY并行/串行:PARALLEL
峰值回流温度(摄氏度):NOT SPECIFIED认证状态:Not Qualified
座面最大高度:2.4 mm最大供电电压 (Vsup):3.465 V
最小供电电压 (Vsup):3.135 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:BALL端子节距:1.27 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:14 mmBase Number Matches:1

MCM63P737ZP133R 数据手册

 浏览型号MCM63P737ZP133R的Datasheet PDF文件第2页浏览型号MCM63P737ZP133R的Datasheet PDF文件第3页浏览型号MCM63P737ZP133R的Datasheet PDF文件第4页浏览型号MCM63P737ZP133R的Datasheet PDF文件第5页浏览型号MCM63P737ZP133R的Datasheet PDF文件第6页浏览型号MCM63P737ZP133R的Datasheet PDF文件第7页 
MOTOROLA  
SEMICONDUCTOR TECHNICAL DATA  
Order this document  
by MCM63P737/D  
MCM63P737  
MCM63P819  
128K x 36 and 256K x 18 Bit  
Pipelined BurstRAM  
Synchronous Fast Static RAM  
The MCM63P737 and MCM63P819 are 4M–bit synchronous fast static RAMs  
designed to provide a burstable, high performance, secondary cache for the  
PowerPC and other high performance microprocessors. The MCM63P737 is  
organized as 128K words of 36 bits each and the MCM63P819 is organized as  
256K words of 18 bits each. These devices integrate input registers, an output  
register, a 2–bit address counter, and high speed SRAM onto a single monolithic  
circuit for reduced parts count in cache data RAM applications. Synchronous  
design allows precise cycle control with the use of an external clock (K).  
Addresses (SA), data inputs (DQx), and all control signals except output  
enable (G), sleep mode (ZZ), and linear burst order (LBO) are clock (K)  
controlled through positive–edge–triggered noninverting registers.  
Bursts can be initiated with either ADSP or ADSC input pins. Subsequent burst  
addresses can be generated internally by the MCM63P737 and MCM63P819  
(burstsequenceoperatesinlinearorinterleavedmodedependentuponthestate  
of LBO) and controlled by the burst address advance (ADV) input pin.  
Write cycles are internally self–timed and are initiated by the rising edge of the  
clock (K) input. This feature eliminates complex off–chip write pulse generation  
and provides increased timing flexibility for incoming signals.  
TQ PACKAGE  
TQFP  
CASE 983A–01  
ZP PACKAGE  
PBGA  
CASE 999–02  
Synchronous byte write (SBx), synchronous global write (SGW), and synchro-  
nous write enable (SW) are provided to allow writes to either individual bytes or  
to all bytes. The bytes are designated as “a”, “b”, etc. SBa controls DQa, SBb  
controls DQb, etc. Individual bytes are written if the selected byte writes SBx are  
asserted with SW. All bytes are written if either SGW is asserted or if all SBx and  
SW are asserted.  
For read cycles, pipelined SRAMs output data is temporarily stored by an  
edge–triggeredoutput register and then released to the output buffers at the next  
rising edge of clock (K).  
The MCM63P737 and MCM63P819 operate from a 3.3 V core power supply  
and all outputs operate on a 2.5 V or 3.3 V power supply. All inputs and outputs  
are JEDEC standard JESD8–5 compatible.  
MCM63P737/MCM63P819–166 = 3.5 ns Access/6 ns Cycle (166 MHz)  
MCM63P737/MCM63P819–150 = 3.8 ns Access/6.7 ns Cycle (150 MHz)  
MCM63P737/MCM63P819–133 = 4 ns Access/7.5 ns Cycle (133 MHz)  
3.3 V + 10%, – 5% Core Power Supply, 2.5 V or 3.3 V I/O Supply  
ADSP, ADSC, and ADV Burst Control Pins  
Selectable Burst Sequencing Order (Linear/Interleaved)  
Single–Cycle Deselect Timing  
Internally Self–Timed Write Cycle  
Byte Write and Global Write Control  
Sleep Mode (ZZ)  
JEDEC Standard 100–Pin TQFP and 119–Pin PBGA Packages  
The PowerPC name is a trademark of IBM Corp., used under license therefrom.  
REV 2  
3/12/99  
Motorola, Inc. 1999  

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