是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Transferred | 零件包装代码: | BGA |
包装说明: | FBGA, BGA529,23X23,32 | 针数: | 529 |
Reach Compliance Code: | unknown | ECCN代码: | 5A002.A |
HTS代码: | 8542.31.00.01 | 风险等级: | 3.9 |
地址总线宽度: | 16 | 边界扫描: | YES |
总线兼容性: | ETHERNET; I2C; I2S; IRDA; RS-232; SPI; UART; USB | 最大时钟频率: | 27 MHz |
外部数据总线宽度: | 32 | JESD-30 代码: | S-PBGA-B529 |
JESD-609代码: | e2 | 长度: | 19 mm |
湿度敏感等级: | 3 | I/O 线路数量: | 19 |
端子数量: | 529 | 最高工作温度: | 85 °C |
最低工作温度: | -20 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | FBGA | 封装等效代码: | BGA529,23X23,32 |
封装形状: | SQUARE | 封装形式: | GRID ARRAY, FINE PITCH |
峰值回流温度(摄氏度): | 260 | 电源: | 0.9/1.25,1.3 V |
认证状态: | Not Qualified | RAM(字数): | 144K |
座面最大高度: | 1.85 mm | 子类别: | Graphics Processors |
最大供电电压: | 1.4 V | 最小供电电压: | 1.2 V |
标称供电电压: | 1.25 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | OTHER |
端子面层: | Tin/Silver (Sn/Ag) | 端子形式: | BALL |
端子节距: | 0.8 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | 40 | 宽度: | 19 mm |
uPs/uCs/外围集成电路类型: | MICROPROCESSOR CIRCUIT | Base Number Matches: | 1 |
型号 | 品牌 | 描述 | 获取价格 | 数据表 |
MCIMX535DVV1CR2 | NXP | SPECIALTY MICROPROCESSOR CIRCUIT |
获取价格 |
|
MCIMX535DVV2C | NXP | i.MX53 32-bit MPU, ARM Cortex-A8 core, 1.2GHz, PBGA 529 |
获取价格 |
|
MCIMX536AVV8C | FREESCALE | Automotive and Infotainment Applications Processors |
获取价格 |
|
MCIMX536AVV8C | NXP | 32-BIT, 800MHz, RISC PROCESSOR, PBGA529, 19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTI |
获取价格 |
|
MCIMX537CVP8C2 | NXP | Multimedia Applications Processors - HD Video, High-End, Advanced Applications, Arm |
获取价格 |
|
MCIMX537CVV8C | NXP | i.MX53 32-bit MPU, ARM Cortex-A8 core, 800MHz, PBGA 529 |
获取价格 |