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MCIMX537CVV8C PDF预览

MCIMX537CVV8C

更新时间: 2024-01-25 11:14:47
品牌 Logo 应用领域
恩智浦 - NXP 时钟外围集成电路
页数 文件大小 规格书
173页 2271K
描述
i.MX53 32-bit MPU, ARM Cortex-A8 core, 800MHz, PBGA 529

MCIMX537CVV8C 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:BGA
包装说明:19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, TEPBGA-529针数:529
Reach Compliance Code:unknownECCN代码:5A002.A
HTS代码:8542.31.00.01风险等级:8.02
地址总线宽度:26位大小:32
边界扫描:YES最大时钟频率:27 MHz
外部数据总线宽度:32格式:FLOATING POINT
集成缓存:YESJESD-30 代码:S-PBGA-B529
JESD-609代码:e2长度:19 mm
低功率模式:YES湿度敏感等级:3
端子数量:529封装主体材料:PLASTIC/EPOXY
封装代码:FBGA封装等效代码:BGA529,23X23,32
封装形状:SQUARE封装形式:GRID ARRAY, FINE PITCH
峰值回流温度(摄氏度):260电源:1.1,1.3 V
认证状态:Not Qualified座面最大高度:1.85 mm
速度:800 MHz子类别:Graphics Processors
最大供电电压:1.15 V最小供电电压:1.05 V
标称供电电压:1.1 V表面贴装:YES
技术:CMOS端子面层:Tin/Silver (Sn/Ag)
端子形式:BALL端子节距:0.8 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:40
宽度:19 mmuPs/uCs/外围集成电路类型:MICROPROCESSOR, RISC
Base Number Matches:1

MCIMX537CVV8C 数据手册

 浏览型号MCIMX537CVV8C的Datasheet PDF文件第2页浏览型号MCIMX537CVV8C的Datasheet PDF文件第3页浏览型号MCIMX537CVV8C的Datasheet PDF文件第4页浏览型号MCIMX537CVV8C的Datasheet PDF文件第5页浏览型号MCIMX537CVV8C的Datasheet PDF文件第6页浏览型号MCIMX537CVV8C的Datasheet PDF文件第7页 
Document Number: IMX53IEC  
Rev. 7, 05/2015  
Freescale Semiconductor  
Data Sheet: Technical Data  
MCIMX53xC  
i.MX53 Applications  
Processors for Industrial  
Products  
Package Information  
Plastic Package  
Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch  
Silicon Version 2.1  
Ordering Information  
See Table 1 on page 2  
1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
1.1. Functional Part Differences and Ordering  
1 Introduction  
Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
The i.MX53 processor features ARM Cortex™-A8  
core, which operates at clock speeds as high as  
800 MHz. It provides DDR2/LVDDR2-800,  
LPDDR2-800, or DDR3-800 DRAM memories.  
1.2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
2. Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
2.1. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
3. Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
3.1. Special Signal Considerations . . . . . . . . . . . . . . . 16  
4. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 16  
4.1. Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . 16  
4.2. Power Supply Requirements and Restrictions . . . 23  
4.3. I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 26  
4.4. Output Buffer Impedance Characteristics . . . . . . 32  
4.5. I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 36  
4.6. System Modules Timing . . . . . . . . . . . . . . . . . . . . 43  
4.7. External Peripheral Interfaces Parameters . . . . . 65  
4.8. XTAL Electrical Specifications . . . . . . . . . . . . . . 141  
5. Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . 142  
5.1. Boot Mode Configuration Pins . . . . . . . . . . . . . . 142  
5.2. Boot Devices Interfaces Allocation . . . . . . . . . . . 143  
5.3. Power Setup During Boot . . . . . . . . . . . . . . . . . . 144  
6. Package Information and Contact Assignments . . . . . 145  
6.1. 19x19 mm Package Information . . . . . . . . . . . . . 145  
7. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170  
The flexibility of the i.MX53 architecture allows for its  
use in a wide variety of applications. As the heart of the  
application chipset, the i.MX53 processor provides all  
the interfaces for connecting peripherals, such as  
WLAN, Bluetooth™, GPS, hard drive, camera sensors,  
and dual displays.  
Features of the i.MX53 processor include the following:  
Applications processor—The i.MX53xD  
processors boost the capabilities of high-tier  
portable applications by satisfying the ever  
increasing MIPS needs of operating systems and  
games. Freescale’s Dynamic Voltage and  
Frequency Scaling (DVFS) provides significant  
power reduction, allowing the device to run at  
lower voltage and frequency with sufficient  
MIPS for tasks such as audio decode.  
© 2011-2015 Freescale Semiconductor, Inc. All rights reserved.  
 

MCIMX537CVV8C 替代型号

型号 品牌 替代类型 描述 数据表
MCIMX536AVV8C NXP

功能相似

32-BIT, 800MHz, RISC PROCESSOR, PBGA529, 19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTI
MCIMX534AVV8C NXP

功能相似

32-BIT, 800MHz, RISC PROCESSOR, PBGA529, 19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTI

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