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MCIMX535DVV2C PDF预览

MCIMX535DVV2C

更新时间: 2024-01-18 18:37:06
品牌 Logo 应用领域
恩智浦 - NXP /
页数 文件大小 规格书
176页 2294K
描述
i.MX53 32-bit MPU, ARM Cortex-A8 core, 1.2GHz, PBGA 529

MCIMX535DVV2C 数据手册

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Document Number: IMX53CEC  
Rev. 7, 05/2015  
Freescale Semiconductor  
Data Sheet: Technical Data  
MCIMX53xD  
i.MX53xD Applications  
Processors for Consumer  
Products  
Package Information  
Plastic Package  
Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch  
Case FC-PBGA 12 x 12 mm PoP, 0.4 mm pitch  
Silicon Version 2.1  
Ordering Information  
See Table 2 on page 4  
1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
1.1. Functional Part Differences and Ordering  
1 Introduction  
Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
The i.MX53xD multimedia application processor  
represents Freescale Semiconductor’s advanced  
implementation of the ARM Cortex™-A8 core. It  
belongs to a growing family of multimedia-focused  
products that offer high performance processing and are  
optimized for lowest power consumption.  
1.2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
2. Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
2.1. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
3. Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
3.1. Special Signal Considerations . . . . . . . . . . . . . . . 17  
4. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 17  
4.1. Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . 17  
4.2. Power Supply Requirements and Restrictions . . . 25  
4.3. I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 28  
4.4. Output Buffer Impedance Characteristics . . . . . . 34  
4.5. I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 38  
4.6. System Modules Timing . . . . . . . . . . . . . . . . . . . . 45  
4.7. External Peripheral Interfaces Parameters . . . . . 67  
4.8. XTAL Electrical Specifications . . . . . . . . . . . . . . 143  
5. Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . 144  
5.1. Boot Mode Configuration Pins . . . . . . . . . . . . . . 144  
5.2. Boot Devices Interfaces Allocation . . . . . . . . . . . 145  
5.3. Power Setup During Boot . . . . . . . . . . . . . . . . . . 146  
6. Package Information and Contact Assignments . . . . . 147  
6.1. 19x19 mm Package Information . . . . . . . . . . . . . 147  
7. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 172  
The i.MX53xD processor features ARM Cortex™-A8  
core, which operates at clock speeds as high as 1.2 GHz.  
It provides DDR2/LVDDR2-800, LPDDR2-800, or  
DDR3-800 DRAM memories. This device is suitable for  
applications such as the following:  
Tablets  
Smart devices  
Netbooks (web tablets)  
Nettops (Internet desktop devices)  
Thin clients  
Media phones  
Internet monitors  
High-end mobile Internet devices (MID)  
© 2011-2015 Freescale Semiconductor, Inc. All rights reserved.  
 

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