Document Number: IMX53IEC
Rev. 8, 02/2021
NXP Semiconductors
Data Sheet: Technical Data
MCIMX53xC
i.MX53 Applications
Processors for Industrial
Products
Package Information
Plastic Package
Case HW-PWR-TEPBGA-529 19 x 19 mm,
0.8 mm pitch
Silicon Version 2.1
Ordering Information
See Table 1 on page 2
1
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 Functional Part Differences and Ordering Information
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1 Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.1 Special Signal Considerations. . . . . . . . . . . . . . . . 16
Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 16
4.1 Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . . 16
4.2 Power Supply Requirements and Restrictions . . . 23
4.3 I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 26
4.4 Output Buffer Impedance Characteristics . . . . . . . 32
4.5 I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 36
4.6 System Modules Timing . . . . . . . . . . . . . . . . . . . . 43
4.7 External Peripheral Interfaces Parameters . . . . . . 65
4.8 XTAL Electrical Specifications. . . . . . . . . . . . . . . 141
4.9 Integrated LDO Voltage Regulators Parameters. 141
Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . 142
5.1 Boot Mode Configuration Pins. . . . . . . . . . . . . . . 142
5.2 Boot Devices Interfaces Allocation . . . . . . . . . . . 143
5.3 Power Setup During Boot . . . . . . . . . . . . . . . . . . 144
Package Information and Contact Assignments . . . . . . 145
6.1 19x19 mm Package Information . . . . . . . . . . . . . 145
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170
1 Introduction
The i.MX53 processor features ARM Cortex™-A8
core, which operates at clock speeds as high as
800 MHz. It provides DDR2/LVDDR2-800,
LPDDR2-800, or DDR3-800 DRAM memories.
2
3
4
The flexibility of the i.MX53 architecture allows for its
use in a wide variety of applications. As the heart of the
application chipset, the i.MX53 processor provides all
the interfaces for connecting peripherals, such as
WLAN, Bluetooth™, GPS, hard drive, camera sensors,
and dual displays.
5
Features of the i.MX53 processor include the following:
•
Applications processor—The i.MX53xD
processors boost the capabilities of high-tier
portable applications by satisfying the ever
increasing MIPS needs of operating systems and
games. Freescale’s Dynamic Voltage and
Frequency Scaling (DVFS) provides significant
power reduction, allowing the device to run at
lower voltage and frequency with sufficient
MIPS for tasks such as audio decode.
6
7
NXP reserves the right to change the production detail specifications as may be
required to permit improvements in the design of its products.
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