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MCIMX502

更新时间: 2024-11-06 02:47:03
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恩智浦 - NXP /
页数 文件大小 规格书
136页 2523K
描述
i.MX50 Applications Processors for Consumer Products

MCIMX502 数据手册

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Document Number: IMX50CEC  
Rev. 7, 10/2013  
Freescale Semiconductor  
Data Sheet: Technical Data  
MCIMX50  
Package Information  
Plastic Package  
i.MX50 Applications  
Processors for  
Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch  
Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch  
Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch  
Consumer Products  
Ordering Information  
See Table 1 on page 7 for ordering information.  
1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
1.1. Product Overview . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
1.2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
1.3. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 7  
1.4. Part Number Feature Comparison . . . . . . . . . . . . . 8  
1.5. Package Feature Comparison . . . . . . . . . . . . . . . . 9  
2. Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
2.1. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
3. Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
3.1. Special Signal Considerations . . . . . . . . . . . . . . . 17  
4. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 20  
4.1. Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . 21  
4.2. Supply Power-Up/Power-Down Requirements and  
Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29  
4.3. I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 31  
4.4. Output Buffer Impedance Characteristics . . . . . . 37  
4.5. I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 41  
4.6. System Modules Timing . . . . . . . . . . . . . . . . . . . . 48  
4.7. External Interface Module (EIM) . . . . . . . . . . . . . . 60  
4.8. DRAM Timing Parameters . . . . . . . . . . . . . . . . . . 68  
4.9. External Peripheral Interfaces . . . . . . . . . . . . . . . 73  
5. Package Information and Contact Assignments . . . . . 101  
5.1. 13 x 13 mm, 0.5 mm Pitch, 416 Pin MAPBGA Package  
Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101  
1 Introduction  
The i.MX50 applications processors are  
multimedia-focused products offering high-performance  
processing optimized for lowest power consumption.  
The i.MX50 processors are Freescale Energy Efficiency  
Solutions products.  
The i.MX50 is optimized for portable multimedia  
applications and features Freescale’s advanced  
implementation of the ARM Cortex-A8 core, which  
®
operates at speeds as high as 1 GHz. The i.MX50  
provides a powerful display architecture, including a 2D  
Graphics Processing Unit (GPU) and Pixel Processing  
Pipeline (ePXP). Additionally, the i.MX50 includes a  
complete integration of the electrophoretic display  
function. The i.MX50 supports DDR2, LPDDR2, and  
LPDDR1 DRAM at clock rate up to 266 MHz to enable  
a range of performance and power trade-offs.  
5.2. 13 x 13 mm, 0.5 mm Pitch, 416 Pin PoPBGA Package  
Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109  
5.3. 17 x 17 mm, 0.8 mm Pitch, 400 Pin MAPBGA Package  
Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116  
5.4. Signal Assignments . . . . . . . . . . . . . . . . . . . . . . 124  
6. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134  
The flexibility of the i.MX50 architecture allows it to be  
used in a variety of applications. As the heart of the  
Freescale reserves the right to change the detail specifications as may be required  
to permit improvements in the design of its products.  
© 2011–2013 Freescale Semiconductor, Inc. All rights reserved.  

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