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MCIMX503CVM8B PDF预览

MCIMX503CVM8B

更新时间: 2024-11-06 02:55:15
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飞思卡尔 - FREESCALE 外围集成电路
页数 文件大小 规格书
134页 2581K
描述
i.MX50 Applications Processors for Consumer Products

MCIMX503CVM8B 数据手册

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Document Number: IMX50CEC  
Rev. 2, 05/2012  
Freescale Semiconductor  
Data Sheet: Technical Data  
MCIMX50  
Package Information  
Plastic Package  
i.MX50 Applications  
Processors for  
Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch  
Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch  
Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch  
Consumer Products  
Ordering Information  
See Table 1 on page 7 for ordering information.  
1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
1.1. Product Overview . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
1.2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
1.3. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 7  
1.4. Part Number Feature Comparison . . . . . . . . . . . . . 7  
1.5. Package Feature Comparison . . . . . . . . . . . . . . . . 8  
2. Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
2.1. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
3. Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
3.1. Special Signal Considerations . . . . . . . . . . . . . . . 17  
4. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 20  
4.1. Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . 21  
4.2. Supply Power-Up/Power-Down Requirements and  
Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28  
4.3. I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 30  
4.4. Output Buffer Impedance Characteristics . . . . . . 36  
4.5. I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 40  
4.6. System Modules Timing . . . . . . . . . . . . . . . . . . . . 47  
4.7. External Interface Module (EIM) . . . . . . . . . . . . . . 59  
4.8. DRAM Timing Parameters . . . . . . . . . . . . . . . . . . 67  
4.9. External Peripheral Interfaces . . . . . . . . . . . . . . . 72  
5. Package Information and Contact Assignments . . . . . 100  
5.1. 13 x 13 mm, 0.5 mm Pitch, 416 Pin MAPBGA Package  
Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100  
1 Introduction  
The i.MX50 Applications Processors (i.MX50)  
represent Freescale Semiconductor’s latest addition to a  
growing family of multimedia-focused products,  
offering high performance processing optimized for  
lowest power consumption.  
The i.MX50 is optimized for portable multimedia  
applications and it features Freescale’s advanced  
implementation of the ARM Cortex-A8™ core, which  
operates at speed as high as 800 MHz. The i.MX50  
provides a powerful display architecture, including a 2D  
Graphics Processing Unit (GPU) and Pixel Processing  
Pipeline (ePXP). In addition, i.MX508 includes a  
complete integration of the electrophoretic display  
function. The i.MX50 supports DDR2, LPDDR2, and  
LPDDR1 DRAM at clock rate up to 266 MHz to enable  
a range of performance and power trade-offs.  
5.2. 13 x 13 mm, 0.5 mm Pitch, 416 Pin PoPBGA Package  
Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108  
5.3. 17 x 17 mm, 0.8 mm Pitch, 400 Pin MAPBGA Package  
Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115  
5.4. Signal Assignments . . . . . . . . . . . . . . . . . . . . . . 123  
6. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133  
The flexibility of the i.MX50 architecture allows it to be  
used in a variety of applications. As the heart of the  
application chipset, the i.MX50 provides a rich set of  
interfaces for connecting peripherals, such as WLAN,  
Bluetooth™, GPS, and displays.  
© 2012 Freescale Semiconductor, Inc. All rights reserved.  
Freescale reserves the right to change the detail specifications as may be required to permit improvements  
in the design of its products.  

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