是否Rohs认证: | 符合 | 生命周期: | Obsolete |
零件包装代码: | BGA | 包装说明: | 33 X 33 MM, ROHS COMPLIANT, CERAMIC, BGA-1023 |
针数: | 1023 | Reach Compliance Code: | not_compliant |
ECCN代码: | 3A991 | HTS代码: | 8542.31.00.01 |
风险等级: | 5.32 | 地址总线宽度: | 32 |
位大小: | 32 | 边界扫描: | YES |
最大时钟频率: | 1500 MHz | 外部数据总线宽度: | 32 |
格式: | FLOATING POINT | 集成缓存: | YES |
JESD-30 代码: | S-CBGA-B1023 | JESD-609代码: | e2 |
长度: | 33 mm | 低功率模式: | YES |
湿度敏感等级: | 3 | 端子数量: | 1023 |
封装主体材料: | CERAMIC, METAL-SEALED COFIRED | 封装代码: | BGA |
封装形状: | SQUARE | 封装形式: | GRID ARRAY |
峰值回流温度(摄氏度): | 245 | 认证状态: | Not Qualified |
座面最大高度: | 2.77 mm | 速度: | 166.66 MHz |
最大供电电压: | 1.15 V | 最小供电电压: | 1.05 V |
标称供电电压: | 1.1 V | 表面贴装: | YES |
技术: | CMOS | 端子面层: | Tin/Silver (Sn/Ag) |
端子形式: | BALL | 端子节距: | 1 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | 30 |
宽度: | 33 mm | uPs/uCs/外围集成电路类型: | MICROPROCESSOR |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
MC8641VU1500KC | NXP |
获取价格 |
32-BIT, 166.66 MHz, MICROPROCESSOR, CBGA1023, 33 X 33 MM, ROHS COMPLIANT, CERAMIC, BGA-102 | |
MC8641VU1500KE | NXP |
获取价格 |
32-Bit Power Architecture SoC, 1500MHz, DDR1/2, AltiVec, GbE, PCI-e, SRIO, 0 to 105C, Rev | |
MC8641VU1500N | FREESCALE |
获取价格 |
Integrated Host Processor Hardware Specifications | |
MC871L | MOTOROLA |
获取价格 |
XOR Gate, DTL, CDIP14 | |
MC8744H | INTEL |
获取价格 |
Microcontroller, 8-Bit, UVPROM, 8051 CPU, 12MHz, CMOS, CDIP40 | |
MC8744H10 | INTEL |
获取价格 |
DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO | |
MC8751H-8 | INTEL |
获取价格 |
Microcontroller, 8-Bit, UVPROM, 8051 CPU, 8MHz, CMOS, CDIP40, | |
MC876F | MOTOROLA |
获取价格 |
J-K Flip-Flop, 2-Func, Negative Edge Triggered, DTL, CDFP14 | |
MC877L | MOTOROLA |
获取价格 |
Binary Counter, Up Direction, DTL, CDIP14 | |
MC8792V | ETC |
获取价格 |
MC8792V PCI EXPRESS MINI CARD POWERFUL, COST EFFECTIVE, STANDARDS-BASED HSPA ENGINE |