MC74VHC74
Dual D−Type Flip−Flop
with Set and Reset
The MC74VHC74 is an advanced high speed CMOS D−type
flip−flop fabricated with silicon gate CMOS technology. It achieves
high speed operation similar to equivalent Bipolar Schottky TTL
while maintaining CMOS low power dissipation.
The signal level applied to the D input is transferred to Q output
during the positive going transition of the Clock pulse.
Reset (RD) and Set (SD) are independent of the Clock (CP) and are
accomplished by setting the appropriate input Low.
The internal circuit is composed of three stages, including a buffer
output which provides high noise immunity and stable output. The
inputs tolerate voltages up to 7.0 V, allowing the interface of 5.0 V
systems to 3.0 V systems.
http://onsemi.com
MARKING
DIAGRAMS
14
1
SOIC−14
D SUFFIX
CASE 751A
VHC74G
AWLYWW
1
14
Features
VHC
74
TSSOP−14
DT SUFFIX
CASE 948G
• High Speed: f
• Low Power Dissipation: I = 2mA (Max) at T = 25°C
• High Noise Immunity: V
= 170MHz (Typ) at V = 5V
CC
max
ALYWG
CC
A
1
G
= V = 28% V
NIL CC
NIH
1
• Power Down Protection Provided on Inputs
• Balanced Propagation Delays
14
• Designed for 2.0 V to 5.5 V Operating Range
SOEIAJ−14
M SUFFIX
CASE 965
VHC74
ALYWG
• Low Noise: V
= 0.8 V (Max)
OLP
1
• Pin and Function Compatible with Other Standard Logic Families
• Latchup Performance Exceeds 300 mA
1
• ESD Performance:
A
= Assembly Location
Human Body Model > 2000 V;
Machine Model > 200 V
WL, L = Wafer Lot
Y, YY = Year
• Chip Complexity: 128 FETs or 32 Equivalent Gates
• Pb−Free Packages are Available*
WW, W = Work Week
G or G = Pb−Free Package
(Note: Microdot may be in either location)
13
12
11
10
1
2
3
4
FUNCTION TABLE
RD1
D1
RD2
D2
Inputs
Outputs
9
8
5
6
Q2
Q2
Q1
Q1
SD
RD
CP
D
Q
Q
L
H
L
H
H
H
H
H
H
L
L
H
H
H
H
H
X
X
X
X
X
X
H
L
X
X
X
H
L
H*
H
L
L
H
H*
L
CP1
SD1
CP2
SD2
H
L
H
No Change
No Change
No Change
Figure 1. LOGIC DIAGRAM
*Both outputs will remain high as long as Set and Re-
set are low, but the output states are unpredictable
if Set and Reset go high simultaneously.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
March, 2006 − Rev. 5
MC74VHC74/D