MC74HC4046A
Pin No.
Symbol
Name and Function
1
2
3
PCP
PC1
COMP
Phase Comparator Pulse Output
Phase Comparator 1 Output
Comparator Input
OUT
PCP
PC1
1
2
16
V
CC
out
out
OUT
15 PC3
out
out
IN
4
5
6
7
8
9
10
11
12
13
14
15
16
VCO
INH
C1A
C1B
GND
VCO Output
Inhibit Input
Capacitor C1 Connection A
Capacitor C1 Connection B
Ground (0 V) V
VCO Input
OUT
COMP
VCO
3
4
14 SIG
in
in
13 PC2
12 R2
11 R1
out
INH
C1A
5
6
7
8
SS
VCO
DEM
IN
Demodulator Output
OUT
C1B
10 DEM
out
R1
R2
PC2
Resistor R1 Connection
Resistor R2 Connection
Phase Comparator 2 Output
Signal Input
Phase Comparator 3 Output
Positive Supply Voltage
GND
9
VCO
in
OUT
SIG
IN
Figure 1. Pin Assignment
PC3
OUT
V
CC
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
V
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high−impedance cir-
V
DC Supply Voltage (Referenced to GND)
DC Input Voltage (Referenced to GND)
DC Output Voltage (Referenced to GND)
DC Input Current, per Pin
– 0.5 to + 7.0
CC
V
– 1.5 to V + 1.5
V
in
CC
V
– 0.5 to V + 0.5
V
out
CC
I
20
25
50
mA
mA
mA
mW
in
cuit. For proper operation, V and
in
I
I
DC Output Current, per Pin
out
V
out
should be constrained to the
range GND v (V or V ) v V
.
CC
DC Supply Current, V and GND Pins
in
out
CC
CC
Unused inputs must always be
tied to an appropriate logic voltage
P
Power Dissipation in Still Air
Plastic DIP†
SOIC Package†
750
500
D
level (e.g., either GND or V ).
CC
Unused outputs must be left open.
T
Storage Temperature
– 65 to + 150
_C
_C
stg
T
Lead Temperature, 1 mm from Case for 10 Seconds
Plastic DIP and SOIC Package†
L
260
Maximum ratings are those values beyond which device damage can occur. Maximum ratings
applied to the device are individual stress limit values (not normal operating conditions) and are not
valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
†Derating — Plastic DIP: – 10 mW/_C from 65_ to 125_C
SOIC Package: – 7 mW/_C from 65_ to 125_C
For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor High−Speed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
3.0
2.0
0
Max
6.0
Unit
V
V
CC
V
CC
DC Supply Voltage (Referenced to GND)
DC Supply Voltage (Referenced to GND) NON−VCO
DC Input Voltage, Output Voltage (Referenced to GND)
Operating Temperature, All Package Types
6.0
V
V , V
in out
V
V
CC
T
A
– 55
+ 125
_C
ns
t , t
r
Input Rise and Fall Time
(Pin 5)
V
V
V
= 2.0 V
= 4.5 V
= 6.0 V
0
0
0
1000
500
400
f
CC
CC
CC
http://onsemi.com
2