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MC1413_06

更新时间： 2024-11-21 04:41:03
品牌 Logo 应用领域
安森美 - ONSEMI 晶体晶体管达林顿晶体管
页数 文件大小 规格书
8页 76K
描述
High Voltage, High Current Darlington Transistor Arrays

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MC1413_06 数据手册

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MC1413, MC1413B,  
NCV1413B  
High Voltage, High Current  
Darlington Transistor Arrays  
The seven NPN Darlington connected transistors in these arrays are  
well suited for driving lamps, relays, or printer hammers in a variety of  
industrial and consumer applications. Their high breakdown voltage  
and internal suppression diodes insure freedom from problems  
associated with inductive loads. Peak inrush currents to 500 mA  
permit them to drive incandescent lamps.  
http://onsemi.com  
PDIP−16  
P SUFFIX  
CASE 648  
16  
The MC1413, B with a 2.7 kW series input resistor is well suited for  
systems utilizing a 5.0 V TTL or CMOS Logic.  
1
SOIC−16  
D SUFFIX  
CASE 751B  
Features  
• Pb−Free Packages are Available*  
16  
• NCV Prefix for Automotive and Other Applications Requiring Site  
1
and Control Changes  
ORDERING INFORMATION  
1/7 MC1413, B  
†
Device  
MC1413D  
Package  
Shipping  
2.7 k  
5.0 k  
Pin 9  
SOIC−16  
48 Units/Rail  
48 Units/Tube  
MC1413DG  
SOIC−16  
(Pb−Free)  
3.0 k  
MC1413DR2  
SOIC−16 2500 Tape & Reel  
MC1413DR2G  
SOIC−16 2500 Tape & Reel  
(Pb−Free)  
Figure 1. Representative Schematic Diagram  
MC1413P  
PDIP−16  
25 Units/Rail  
25 Units/Rail  
MC1413PG  
PDIP−16  
(Pb−Free)  
1
2
3
4
5
6
16  
15  
14  
13  
12  
11  
10  
9
MC1413BD  
SOIC−16  
48 Units/Rail  
48 Units/Rail  
MC1413BDG  
SOIC−16  
(Pb−Free)  
MC1413BDR2  
SOIC−16 2500 Tape & Reel  
MC1413BDR2G  
SOIC−16 2500 Tape & Reel  
(Pb−Free)  
MC1413BP  
PDIP−16  
25 Units/Rail  
25 Units/Rail  
MC1413BPG  
PDIP−16  
(Pb−Free)  
NCV1413BDR2  
SOIC−16 2500 Tape & Reel  
NCV1413BDR2G SOIC−16 2500 Tape & Reel  
(Pb−Free)  
7
8
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
(Top View)  
DEVICE MARKING INFORMATION  
See general marking information in the device marking  
Figure 2. PIN CONNECTIONS  
section on page 5 of this data sheet.  
*For additional information on our Pb−Free strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques Reference  
Manual, SOLDERRM/D.  
© Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
July, 2006 − Rev. 8  
MC1413/D  
12345678

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