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MBM29F160TE90TN-E1 PDF预览

MBM29F160TE90TN-E1

更新时间: 2024-11-23 14:30:23
品牌 Logo 应用领域
飞索 - SPANSION 光电二极管内存集成电路
页数 文件大小 规格书
50页 568K
描述
Flash, 1MX16, 90ns, PDSO48, PLASTIC, TSOP1-48

MBM29F160TE90TN-E1 技术参数

是否Rohs认证:符合生命周期:Obsolete
零件包装代码:TSOP1包装说明:PLASTIC, TSOP1-48
针数:48Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8542.32.00.51
风险等级:5.39Is Samacsys:N
最长访问时间:90 ns备用内存宽度:8
启动块:TOPJESD-30 代码:R-PDSO-G48
JESD-609代码:e3长度:18.4 mm
内存密度:16777216 bit内存集成电路类型:FLASH
内存宽度:16功能数量:1
端子数量:48字数:1048576 words
字数代码:1000000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:1MX16封装主体材料:PLASTIC/EPOXY
封装代码:TSOP1封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE并行/串行:PARALLEL
峰值回流温度(摄氏度):260编程电压:5 V
认证状态:Not Qualified座面最大高度:1.2 mm
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):4.5 V
标称供电电压 (Vsup):5 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:MATTE TIN端子形式:GULL WING
端子节距:0.5 mm端子位置:DUAL
处于峰值回流温度下的最长时间:40类型:NOR TYPE
宽度:12 mmBase Number Matches:1

MBM29F160TE90TN-E1 数据手册

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TM  
SPANSION Flash Memory  
Data Sheet  
September 2003  
This document specifies SPANSIONTM memory products that are now offered by both Advanced Micro Devices and  
Fujitsu. Although the document is marked with the name of the company that originally developed the specification,  
these products will be offered to customers of both AMD and Fujitsu.  
Continuity of Specifications  
There is no change to this datasheet as a result of offering the device as a SPANSIONTM product. Future routine  
revisions will occur when appropriate, and changes will be noted in a revision summary.  
Continuity of Ordering Part Numbers  
AMD and Fujitsu continue to support existing part numbers beginning with "Am" and "MBM". To order these  
products, please use only the Ordering Part Numbers listed in this document.  
For More Information  
Please contact your local AMD or Fujitsu sales office for additional information about SPANSIONTM memory  
solutions.  

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MBM29F200BC-55PFTR FUJITSU

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2M (256K X 8/128K X 16) BIT