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MB6S/30-E3 PDF预览

MB6S/30-E3

更新时间: 2024-11-04 18:57:43
品牌 Logo 应用领域
威世 - VISHAY 光电二极管
页数 文件大小 规格书
2页 42K
描述
DIODE 0.5 A, 600 V, SILICON, BRIDGE RECTIFIER DIODE, TO-269AA, PLASTIC, MBS, 4 PIN, Bridge Rectifier Diode

MB6S/30-E3 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:TO-269AA
包装说明:R-PDSO-G4针数:4
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8541.10.00.70风险等级:5.57
配置:BRIDGE, 4 ELEMENTS二极管元件材料:SILICON
二极管类型:BRIDGE RECTIFIER DIODEJEDEC-95代码:TO-269AA
JESD-30 代码:R-PDSO-G4JESD-609代码:e3
湿度敏感等级:1最大非重复峰值正向电流:35 A
元件数量:4相数:1
端子数量:4最高工作温度:150 °C
最低工作温度:-55 °C最大输出电流:0.5 A
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
认证状态:Not Qualified最大重复峰值反向电压:600 V
表面贴装:YES端子面层:MATTE TIN
端子形式:GULL WING端子位置:DUAL
处于峰值回流温度下的最长时间:40Base Number Matches:1

MB6S/30-E3 数据手册

 浏览型号MB6S/30-E3的Datasheet PDF文件第2页 
MB2S thru MB6S  
Miniature Glass Passivated Single-Phase  
TO-269AA (MBS)  
Surface Mount Bridge Rectifier  
0.029 (0.74)  
0.017 (0.43)  
Reverse Voltage 200 to 600V  
Forward Current 0.5A  
Mounting Pad Layout  
0.272 (6.90)  
0.252 (6.40)  
0.161 (4.10)  
0.144 (3.65)  
0.023 MIN.  
(0.58 MIN.)  
Dimensions in inches  
and (millimeters)  
0.272 MAX.  
0.105 (2.67)  
0.095 (2.41)  
(6.91 MAX.)  
0.030 MIN.  
(0.76 MIN.)  
0.195 (4.95)  
0.179 (4.55)  
0.205 (5.21)  
0.195 (4.95)  
0-8o  
0.049 (1.24)  
0.039 (0.99)  
0.106 (2.70)  
0.090 (2.30)  
0.114 (2.90)  
0.094 (2.40)  
0.105(2.67)  
0.062 (1.57)  
0.095(2.41)  
0.058 (1.47)  
0.008 (0.20)  
0.004 (0.10)  
0.016 (0.41)  
0.006 (0.15)  
0.0075 (0.19)  
0.0065 (0.16)  
Features  
• Plastic package has Underwriters Laboratory  
Flammability Classification 94V-0  
0.114 (2.90)  
0.110 (2.80)  
0.018 (0.46)  
0.014 (0.36)  
0.038 (0.96)  
0.019 (0.48)  
0.058 (1.47)  
0.054 (1.37)  
Mechanical Data  
Case: Molded plastic body over passivated junctions  
Terminals: Plated leads solderable  
• This series is UL recognized under Component Index,  
file number E54214  
• Glass passivated chip junctions  
• High surge overload rating: 35A peak  
• Saves space on printed circuit boards  
High temperature soldering guaranteed: 260°C/10 seconds.  
per MIL-STD-750, Method 2026  
Mounting Position: Any Weight: 0.078 oz., 0.22 g  
Packaging codes/options: 30/3K per 13” Reel (12mm tape)  
Maximum Ratings and Thermal Characteristics(TA = 25°C unless otherwise noted)  
Parameter  
Symbol  
MB2S  
MB4S  
MB6S  
Unit  
Device marking code  
2
4
6
Maximum repetitive peak reverse voltage  
Maximum RMS voltage  
VRRM  
VRMS  
VDC  
200  
140  
200  
400  
280  
400  
600  
420  
600  
V
V
V
Maximum DC blocking voltage  
Maximum average forward output rectified current  
(see Fig. 1)  
on glass-epoxy P.C.B.  
on aluminum substrate  
IF(AV)  
0.5(1)  
0.8(2)  
A
Peak forward surge current 8.3msec single half sine-wave  
superimposed on rated load (JEDEC Method)  
IFSM  
I2t  
35  
A
Rating for fusing (t < 8.3ms)  
5.0  
A2sec  
RΘJA  
RΘJA  
RΘJL  
85(1)  
70(2)  
20(1)  
Typical thermal resistance per leg  
°C/W  
°C  
Operating junction and storage temperature range  
TJ, TSTG  
–55 to +150  
Electrical Characteristics(TA = 25°C unless otherwise noted)  
Max. instantaneous forward voltage drop per leg at 4.0A  
VF  
1.0  
V
Maximum DC reverse current at  
rated DC blocking voltage per leg  
TA = 25°C  
TA = 125°C  
5.0  
100  
IR  
µA  
pF  
Typical junction capacitance per leg(3)  
CJ  
13  
Notes: (1) On glass epoxy P.C.B. mounted on 0.05 x 0.05" (1.3 x 1.3mm) pads  
6/15/00  
(2) On aluminum substrate P.C.B. with an area of 0.8" x 0.8" (20 x 20mm) mounted on 0.05 x 0.05" (1.3 x 1.3mm) solder pad  
(3) Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts  

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