是否无铅: | 含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Obsolete | 零件包装代码: | DIP |
包装说明: | 0.300 INCH, PLASTIC, MS-001AB, DIP-8 | 针数: | 8 |
Reach Compliance Code: | not_compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | Factory Lead Time: | 1 week |
风险等级: | 5.23 | 其他特性: | MANUAL RESET, POWER FAIL COMPARATOR |
可调阈值: | NO | 模拟集成电路 - 其他类型: | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码: | R-PDIP-T8 | JESD-609代码: | e0 |
长度: | 9.375 mm | 湿度敏感等级: | 1 |
信道数量: | 1 | 功能数量: | 1 |
端子数量: | 8 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | DIP | 封装等效代码: | DIP8,.3 |
封装形状: | RECTANGULAR | 封装形式: | IN-LINE |
峰值回流温度(摄氏度): | 245 | 电源: | 5 V |
认证状态: | Not Qualified | 座面最大高度: | 4.572 mm |
子类别: | Power Management Circuits | 最大供电电流 (Isup): | 0.5 mA |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 1.2 V |
标称供电电压 (Vsup): | 3 V | 表面贴装: | NO |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | Tin/Lead (Sn/Pb) | 端子形式: | THROUGH-HOLE |
端子节距: | 2.54 mm | 端子位置: | DUAL |
阈值电压标称: | +2.93V | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 7.62 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
MAX708SEPA+ | MAXIM |
获取价格 |
暂无描述 | |
MAX708SESA | MAXIM |
获取价格 |
+3V Voltage Monitoring, Low-Cost, レP Supervis | |
MAX708SESA+ | MAXIM |
获取价格 |
Power Supply Support Circuit, Fixed, 1 Channel, CMOS, PDSO8, 0.150 INCH, LEAD FREE, MS-012 | |
MAX708SESA+T | MAXIM |
获取价格 |
Power Supply Support Circuit, Adjustable, 2 Channel, CMOS, PDSO8, 0.150 INCH, SOP-8 | |
MAX708SESA-T | ONSEMI |
获取价格 |
UP Supervisory Circuits | |
MAX708SESA-T | MAXIM |
获取价格 |
Analog IC | |
MAX708SESA-TG | ONSEMI |
获取价格 |
UP Supervisory Circuits | |
MAX708SEUA | MAXIM |
获取价格 |
+3V Voltage Monitoring, Low-Cost uP Supervisory Circuits | |
MAX708SMJA | MAXIM |
获取价格 |
+3V Voltage Monitoring, Low-Cost, レP Supervis | |
MAX708SMJA/883B | MAXIM |
获取价格 |
Power Supply Support Circuit, Fixed, 1 Channel, CMOS, CDIP8, 0.300 INCH, CERDIP-8 |