是否无铅: | 含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Obsolete | 零件包装代码: | SOIC |
包装说明: | 0.150 INCH, MS-012AA, SOP-8 | 针数: | 8 |
Reach Compliance Code: | not_compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.1 |
Is Samacsys: | N | 其他特性: | MANUAL RESET, POWER FAIL COMPARATOR |
可调阈值: | NO | 模拟集成电路 - 其他类型: | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码: | R-PDSO-G8 | JESD-609代码: | e0 |
长度: | 4.9 mm | 湿度敏感等级: | 1 |
信道数量: | 1 | 功能数量: | 1 |
端子数量: | 8 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | SOP | 封装等效代码: | SOP8,.25 |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE |
峰值回流温度(摄氏度): | 245 | 电源: | 3.3/5 V |
认证状态: | Not Qualified | 座面最大高度: | 1.75 mm |
子类别: | Power Management Circuits | 最大供电电流 (Isup): | 0.5 mA |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 1.2 V |
标称供电电压 (Vsup): | 3 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | Tin/Lead (Sn/Pb) | 端子形式: | GULL WING |
端子节距: | 1.27 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 3.9 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
MAX708SESA+ | MAXIM |
完全替代 |
Power Supply Support Circuit, Fixed, 1 Channel, CMOS, PDSO8, 0.150 INCH, LEAD FREE, MS-012 | |
MAX708RESA+ | MAXIM |
类似代替 |
Power Supply Support Circuit, Fixed, 1 Channel, CMOS, PDSO8, 0.150 INCH, LEAD FREE, MS-012 |
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MAX708TCPA+ | MAXIM |
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MAX708TCSA+ | MAXIM |
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暂无描述 |