是否无铅: | 含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Obsolete | 零件包装代码: | TSSOP |
包装说明: | MO-187CAA, MICRO, MAX, PACKAGE-8 | 针数: | 8 |
Reach Compliance Code: | not_compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.26 |
其他特性: | MANUAL RESET, POWER FAIL COMPARATOR | 可调阈值: | NO |
模拟集成电路 - 其他类型: | POWER SUPPLY SUPPORT CIRCUIT | JESD-30 代码: | S-PDSO-G8 |
JESD-609代码: | e0 | 长度: | 3 mm |
湿度敏感等级: | 1 | 信道数量: | 1 |
功能数量: | 1 | 端子数量: | 8 |
最高工作温度: | 70 °C | 最低工作温度: | |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | TSSOP |
封装等效代码: | TSSOP8,.19 | 封装形状: | SQUARE |
封装形式: | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 峰值回流温度(摄氏度): | 245 |
电源: | 3.3/5 V | 认证状态: | Not Qualified |
座面最大高度: | 1.1 mm | 子类别: | Power Management Circuits |
最大供电电流 (Isup): | 0.35 mA | 最大供电电压 (Vsup): | 5.5 V |
最小供电电压 (Vsup): | 1 V | 标称供电电压 (Vsup): | 3 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | COMMERCIAL | 端子面层: | Tin/Lead (Sn/Pb) |
端子形式: | GULL WING | 端子节距: | 0.65 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 3 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
MAX708TCUA-TG | ONSEMI |
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UP Supervisory Circuits | |
MAX708TD | NXP |
获取价格 |
IC 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO8, 3.90 MM, PLASTIC, MS-012, SOP-8, Power Manag | |
MAX708TEPA | MAXIM |
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+3V Voltage Monitoring, Low-Cost, レP Supervis | |
MAX708TEPA+ | ROCHESTER |
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1-CHANNEL POWER SUPPLY SUPPORT CKT, PDIP8, 0.300 INCH, LEAD FREE, PLASTIC, MS-001AB, DIP-8 | |
MAX708TESA | MAXIM |
获取价格 |
+3V Voltage Monitoring, Low-Cost, レP Supervis | |
MAX708TESA+T | MAXIM |
获取价格 |
Power Supply Support Circuit, Adjustable, 2 Channel, CMOS, PDSO8, 0.150 INCH, SOP-8 | |
MAX708TESA-T | MAXIM |
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Analog IC | |
MAX708TESA-T | ONSEMI |
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UP Supervisory Circuits | |
MAX708TESA-TG | ONSEMI |
获取价格 |
UP Supervisory Circuits | |
MAX708TEUA | MAXIM |
获取价格 |
+3V Voltage Monitoring, Low-Cost uP Supervisory Circuits |