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MAUPS540E3 PDF预览

MAUPS540E3

更新时间: 2024-09-17 19:02:11
品牌 Logo 应用领域
美高森美 - MICROSEMI 功效二极管
页数 文件大小 规格书
6页 276K
描述
Rectifier Diode, Schottky, 1 Phase, 1 Element, 5A, 40V V(RRM), Silicon, ROHS COMPLIANT, PLASTIC, POWERMITE 3, 2 PIN

MAUPS540E3 技术参数

生命周期:Obsolete包装说明:R-PSSO-G2
针数:2Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8541.10.00.80
风险等级:5.73应用:EFFICIENCY
外壳连接:CATHODE配置:SINGLE
二极管元件材料:SILICON二极管类型:RECTIFIER DIODE
JESD-30 代码:R-PSSO-G2JESD-609代码:e3
最大非重复峰值正向电流:100 A元件数量:1
相数:1端子数量:2
最高工作温度:125 °C最低工作温度:-55 °C
最大输出电流:5 A封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
认证状态:Not Qualified最大重复峰值反向电压:40 V
表面贴装:YES技术:SCHOTTKY
端子面层:MATTE TIN端子形式:GULL WING
端子位置:SINGLEBase Number Matches:1

MAUPS540E3 数据手册

 浏览型号MAUPS540E3的Datasheet PDF文件第2页浏览型号MAUPS540E3的Datasheet PDF文件第3页浏览型号MAUPS540E3的Datasheet PDF文件第4页浏览型号MAUPS540E3的Datasheet PDF文件第5页浏览型号MAUPS540E3的Datasheet PDF文件第6页 
UPS540e3  
5 A Schottky Barrier Rectifier  
KEY FEATURES  
DESCRIPTION  
This UPS540e3 in the Powermite3® package is a high efficiency Schottky  
rectifier that is also RoHS compliant offering high current/power capabilities  
previously found only in much larger packages. They are ideal for SMD  
applications that operate at high frequencies. In addition to its size  
advantages, the Powermite3® package includes a full metallic bottom that  
eliminates the possibility of solder flux entrapment during assembly and a  
unique locking tab act as an efficient heat path to the heat-sink mounting.  
Its innovative design makes this device ideal for use with automatic insertion  
equipment.  
ƒ
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Very low thermal resistance package  
RoHS Compliant with e3 suffix part  
number  
Guard-ring-die construction for transient  
protection  
Efficient heat path with Integral locking  
bottom metal tab  
Low forward voltage  
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ƒ
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Full metallic bottom eliminates flux  
entrapment  
ƒ
ƒ
ƒ
Compatible with automatic insertion  
Low profile-maximum height of 1mm  
Options for screening in accordance with  
MIL-PRF-19500 for JAN, JANTX, and  
JANTXV are available by adding MQ, MX,  
or MV prefixes respectively to part  
numbers. For example, designate  
MXUPS540e3 for a JANTX (consult  
factory for Tin-Lead plating).  
Optional 100% avionics screening  
available by adding MA prefix for 100%  
temperature cycle, thermal impedance  
and 24 hours HTRB (consult factory for  
Tin-Lead plating)  
IMPORTANT: For themost current data, consultMICROSEMI’s website: http://www.microsemi.com  
ABSOLUTE MAXIMUM RATINGS AT 25º C  
(UNLESS OTHERWISE SPECIFIED)  
Rating  
Symbol  
Value  
Unit  
VRRM  
VRWM  
VR  
Peak Repetitive Reverse Voltage  
Working Peak Reverse Voltage  
DC Blocking Voltage  
ƒ
40  
V
RMS Reverse Voltage  
28  
5
V
A
V R (RMS)  
Io  
Average Rectified Output Current  
APPLICATIONS/BENEFITS  
Non-Repetitive Peak Forward Surge Current  
8.3ms Single half sine wave Superimposed  
on Rated Load@ Tc =90 ºC  
100  
A
IFSM  
ƒ
ƒ
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Switching and Regulating Power  
Supplies.  
Silicon Schottky (hot carrier) rectifier for  
minimal reverse voltage recovery  
Elimination of reverse-recovery  
oscillations to reduce need for EMI  
filtering  
Storage Temperature  
Junction Temperature  
TSTG  
TJ  
-55 to +150  
-55 to +125  
ºC  
ºC  
THERMAL CHARACTERISTICS  
ƒ
ƒ
Charge Pump Circuits  
Reduces reverse recovery loss with low  
IRM  
Thermal Resistance  
Junction-to-case (bottom)  
Junction to ambient (1)  
RθJC  
RθJA  
3.2  
65  
ºC/ Watt  
ºC/ Watt  
(1) When mounted on FR-4 PC board using 2 oz copper with recommended minimum foot print  
ƒ
Small foot print  
190 X 270 mils (1:1 Actual size)  
See mounting pad details on pg 3  
Powermite 3™  
MECHANICAL & PACKAGING  
CASE: Void-free transfer molded  
thermosetting epoxy compound meeting  
UL94V-0  
FINISH: Annealed matte-Tin plating over  
copper and readily solderable per MIL-  
STD-750 method 2026 (consult factory  
for Tin-Lead plating)  
POLARITY: See figure (left)  
MARKING: S540•  
WEIGHT: 0.072 gram (approx.)  
Package dimension on last page  
Tape & Reel option: 16 mm tape per  
Standard EIA-481-B, 5000 on 13” reel  
Copyright © 2007  
6-26-2007 Rev D  
Microsemi  
Page 1  

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