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MAUPTB17 PDF预览

MAUPTB17

更新时间: 2024-11-08 05:50:19
品牌 Logo 应用领域
美高森美 - MICROSEMI /
页数 文件大小 规格书
5页 447K
描述
Trans Voltage Suppressor Diode,

MAUPTB17 数据手册

 浏览型号MAUPTB17的Datasheet PDF文件第2页浏览型号MAUPTB17的Datasheet PDF文件第3页浏览型号MAUPTB17的Datasheet PDF文件第4页浏览型号MAUPTB17的Datasheet PDF文件第5页 
MUPT5e3 MUPT48e3  
and MUPTB5e3 MUPTB48e3  
High-Reliability  
Screening available in  
reference to  
5V 48V Powermite1, Surface Mount  
Available  
Transient Voltage Suppressors  
MIL-PRF-19500  
DESCRIPTION  
Tested in accordance  
with the requirements of  
AEC-Q101  
Microsemi’s unique and new Powermite MUPT series of transient voltage suppressors feature  
oxide-passivated chips with high-temperature solder bonds for high surge capability and negligible  
electrical degradation under repeated surge conditions. Both unidirectional and bidirectional  
configurations are available. In addition to its size advantages, the Powermite package includes a  
fully metallic bottom (anode) side that eliminates the possibility of solder flux entrapment at  
assembly and a unique locking tab design serves as an integral heat sink. Its innovative design  
makes this device fully compatible for use with automatic insertion equipment.  
Important: For the latest information, visit our website http://www.microsemi.com.  
FEATURES  
Powermite package with standoff voltages 5 to 48 V.  
Both unidirectional and bidirectional polarities:  
-Anode to case bottom (MUPT5e3 thru MUPT48e3)  
-Bidirectional (MUPTB5e3 thru MUPTB48e3)  
Clamping time less than 100 pico-seconds for unidirectional and 5 nano-seconds for bidirectional.  
100% surge current testing of all parts.  
Moisture classification is Level 1 with no dry pack required per IPC/JEDEC J-STD-020B.  
Both RoHS and non-RoHS compliant versions available.  
DO-216AA  
Package  
APPLICATIONS / BENEFITS  
Protects sensitive components such as IC’s, CMOS, Bipolar, BiCMOS, ECL, DTL, T2L, etc.  
Protection from switching and induced RF transients.  
-Integral heat sink / locking tabs  
-Fully metallic bottom side eliminates flux entrapment  
Compliant to IEC61000-4-2 and IEC61000-4-4 for ESD and EFT protection respectively.  
Secondary lightning protection per IEC61000-4-5 with 42 Ohms source impedance:  
Class 1: MUPT5 /MUPTB8 to 17  
Class 2: MUPT5 /MUPTB5 to 12  
MAXIMUM RATINGS  
Power Discretes & Modules  
Business Unit  
Discrete Products Group  
Microsemi Corporation  
Parameters/Test Conditions  
Symbol  
TJ / TSTG  
RӨJA  
Value  
Unit  
oC  
Junction and Storage Temperature  
Thermal Resistance Junction-to-Ambient (1)  
Thermal Resistance Junction-to-Case (base tab)  
Peak Pulse Power (see Figure 1 and Figure 2)  
MUPT5e3 thru MUPT48e3:  
-65 to +150  
240  
oC/W  
oC/W  
PDM Lawrence  
6 Lake Street,  
Lawrence, MA 01841  
Tel: 1-800-446-1158 or  
(978) 620-2600  
RӨJC  
15  
@ 8/20 µs @10/1000µs  
PPP  
PM(AV)  
TSP  
1000  
1000  
150  
150  
MUPTB5e3 thru MUPTB48e3:  
W
W
Fax: (978) 689-0803  
PDM Ireland  
Rated Average Power Dissipation  
(base tab < 112 oC)  
2.5  
Gort Road Business Park,  
Ennis, Co. Clare, Ireland  
Tel: +353 (0) 65 6840044  
Fax: +353 (0) 65 6822298  
Impulse Repetition Rate (duty factor)  
Solder Temperature @ 10 s  
0.01  
260  
%
oC  
Notes: 1. When mounted on FR4 PC board with 1 oz copper.  
Website:  
www.microsemi.com  
RF01103-1, Rev. B (19/05/17)  
©2017 Microsemi Corporation  
Page 1 of 5  

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