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MAAPGM0027-DIE PDF预览

MAAPGM0027-DIE

更新时间: 2024-11-25 04:17:07
品牌 Logo 应用领域
泰科 - TE 放大器功率放大器
页数 文件大小 规格书
6页 274K
描述
2.0-4.0 GHz 1W Power Amplifier

MAAPGM0027-DIE 技术参数

生命周期:Transferred包装说明:0.117 X 0.062 INCH, 0.003 INCH HEIGHT, DIE
Reach Compliance Code:unknown风险等级:5.69
功能数量:1封装等效代码:DIE OR CHIP
电源:-2,8 V子类别:RF/Microwave Amplifiers
技术:GAASBase Number Matches:1

MAAPGM0027-DIE 数据手册

 浏览型号MAAPGM0027-DIE的Datasheet PDF文件第2页浏览型号MAAPGM0027-DIE的Datasheet PDF文件第3页浏览型号MAAPGM0027-DIE的Datasheet PDF文件第4页浏览型号MAAPGM0027-DIE的Datasheet PDF文件第5页浏览型号MAAPGM0027-DIE的Datasheet PDF文件第6页 
2.0-4.0 GHz 1W Power Amplifier  
MAAPGM0027-DIE  
RO-P-DS-3014 B  
Preliminary Information  
Features  
1 Watt Saturated Output Power Level  
Variable Drain Voltage (4-10V) Operation  
MSAG™ MESFET Process  
Proven Manufacturability and Reliability  
No Airbridges  
Polyimide Scratch Protection  
No Hydrogen Poisoning Susceptibility  
Description  
The MAAPGM0027-Die is a 2-stage power amplifier with on-chip bias  
networks. This product is fully matched to 50 ohms on both the input  
and output. It can be used as a power amplifier stage or as a driver  
stage in high power applications.  
Fabricated using M/A-COM’s repeatable, high performance and highly  
reliable GaAs Multifunction Self-Aligned Gate MESFET Process, each  
device is 100% RF tested on wafer to ensure performance compliance.  
Primary Applications  
Wireless Local Loop 3.4-3.6 GHz  
MMDS 2.5-2.7 GHz  
Radar  
M/A-COM’s MSAG™ process features robust silicon-like manufactur-  
ing processes, planar processing of ion implanted transistors, multiple  
implant capability enabling power, low-noise, switch and digital FETs  
on a single chip, and polyimide scratch protection for ease of use with  
automated manufacturing processes. The use of refractory metals and  
the absence of platinum in the gate metal formulation prevents hydro-  
gen poisoning when employed in hermetic packaging.  
Electrical Characteristics: TB = 40°C1, Z0 = 50 Ω, VDD = 8V, IDQ 230mA2, Pin = 10 dBm  
Parameter  
Bandwidth  
Symbol  
Typical  
2.0-4.0  
30  
Units  
GHz  
dBm  
%
f
Output Power  
POUT  
PAE  
Power Added Efficiency  
1-dB Compression Point  
Small Signal Gain  
Input VSWR  
35  
29  
dBm  
dB  
P1dB  
G
22  
VSWR  
VSWR  
1.8:1  
1.4:1  
Output VSWR  
Gate Supply Current  
Drain Supply Current  
< 2  
< 350  
37  
mA  
mA  
IGG  
IDD  
Output Third Order Intercept  
OTOI  
IM3  
dBm  
dBm  
3rd Order Intermodulation Distortion  
Single Carrier Level = 21 dBm  
-15  
5th Order Intermodulation Distortion  
Single Carrier Level = 21 dBm  
IM5  
-39  
dBm  
Noise Figure  
2nd Harmonic  
NF  
2f  
6
dB  
-15  
-25  
dBc  
dBc  
3rd Harmonic  
3f  
1. TB = MMIC Base Temperature  
2. Adjust VGG between –2.4 and –1.5V to achieve indicated IDQ  
.
1
M/A-COM Inc. and its affiliates reserve the right to make changes to the  
product(s) or information contained herein without notice. M/A-COM makes  
no warranty, representation or guarantee regarding the suitability of its  
products for any particular purpose, nor does M/A-COM assume any liability  
whatsoever arising out of the use or application of any product(s) or  
information.  
North America Tel: 800.366.2266 / Fax: 978.366.2266  
Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300  
Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298  
Visit www.macom.com for additional data sheets and product information.  

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