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MAAP-011246-TR0500

更新时间： 2024-11-06 01:12:59
品牌 Logo 应用领域
泰科 - TE 射频微波
页数 文件大小 规格书
10页 1418K
描述
Power Amplifier

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MAAP-011246-TR0500 数据手册

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MAAP-011246  
Power Amplifier, 2 W  
27.5 - 31.5 GHz  
Rev. V1  
Features  
Functional Schematic  
High Gain: 23 dB  
P1dB: 30 dBm  
PSAT: 33 dBm  
IM3 Level: -22 dBc @ POUT 27 dBm/tone  
Power Added Efficiency: 24% at PSAT  
Lead-Free 5 mm AQFN 32-lead Package  
RoHS* Compliant  
32 31 30  
28  
26 25  
29  
27  
GND  
N/C  
1
2
3
4
5
6
7
8
GND  
N/C  
24  
23  
22  
21  
GND  
RFIN  
N/C  
GND  
RFOUT  
GND  
N/C  
Description  
The MAAP-011246 is a 2 Watt, 4-stage power  
amplifier assembled in a lead-free 5 mm 32-lead  
AQFN plastic package. This power amplifier  
operates from 27.5 to 31.5 GHz and provides 23 dB  
of linear gain, 2 W saturated output power and 24%  
efficiency while biased at 6 V.  
20  
19  
18  
N/C  
N/C  
N/C  
GND  
17 GND  
11  
13 14 15  
9
10  
12  
16  
The MAAP-011246 can be used as a power  
amplifier stage or as a driver stage in higher power  
applications. This device is ideally suited for VSAT  
and 28 GHz PTP applications.  
Pin Configuration3  
This product is fabricated using a GaAs pHEMT  
process which features full passivation for enhanced  
reliability.  
Pin No.  
1
Function  
Ground  
Pin No.  
20  
Function  
Ground  
2
No Connection  
Ground  
21  
RF Output  
Ground  
3
22  
4
RF Input  
23  
No Connection  
Ground  
5 - 7  
8, 9  
10  
No Connection  
Ground  
24, 25  
26  
Ordering Information1,2  
Drain Voltage 4  
Drain Voltage 3  
Drain Voltage 2  
No Connection  
Drain Voltage 1  
Ground  
Part Number  
Package  
Gate Voltage  
Gate Voltage  
No Connection  
Drain Voltage 4  
Ground  
27, 28  
29  
MAAP-011246-TR0500  
500 Piece Reel  
11  
12 - 14  
15  
30  
MAAP-011246-1SMB  
Sample Board  
31  
1. Reference Application Note M513 for reel size information.  
2. All sample boards include 3 loose parts.  
16, 17  
18, 19  
32  
No Connection Paddle4  
Ground  
3. MACOM recommends connecting all No Connection (N/C)  
pins to ground.  
4. The exposed pad centered on the package bottom must be  
connected to RF, DC and thermal ground.  
*Restrictions on Hazardous Substances,  
European Union Directive 2011/65/EU.  
1
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.  
Visit www.macom.com for additional data sheets and product information.  
For further information and support please visit:  
https://www.macom.com/support  
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