Material Content Data Sheet
Sales Product Name TLE4253GS
Issued
28. August 2013
82.07 mg
MA#
MA000970040
PG-DSO-8-10
Package
Weight*
Average
Mass
[%]
Average
CAS#
Weight
[mg]
Sum
Mass
[%]
Sum
Construction Element
Material Group
Substances
[ppm]
if applicable
[ppm]
chip
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
silicon
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-57-5
1333-86-4
-
2.234
0.009
0.037
0.742
30.114
0.137
0.095
5.125
42.237
0.001
0.003
0.050
0.002
0.002
0.001
0.001
0.038
0.274
0.971
2.72
0.01
0.05
0.90
36.69
0.17
0.12
6.24
51.48
0.00
0.00
0.06
0.00
0.00
0.00
0.00
0.05
0.33
1.18
2.72
27215
113
27215
leadframe
phosphorus
zinc
452
iron
9036
366915
1670
1156
62449
514628
18
copper
gold
37.65
0.17
376516
1670
wire
encapsulation
organic material
plastics
carbon black
epoxy resin
silicondioxide
silver
inorganic material
noble metal
60676-86-0
7440-22-4
7440-57-5
7440-02-0
7440-05-3
7440-57-5
7440-22-4
7440-05-3
7440-02-0
-
57.84
0.06
578233
678
leadfinish
plating
noble metal
gold
33
non noble metal
noble metal
nickel
606
palladium
gold
21
noble metal
25
noble metal
silver
14
noble metal
palladium
nickel
16
non noble metal
plastics
0.05
1.51
461
516
glue
acrylic resin
silver
3338
11834
noble metal
7440-22-4
15172
*deviation
< 10%
Sum in total: 100,00
1000000
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com