Material Content Data Sheet
Sales Product Name ICB1FL02G
Issued
29. August 2013
592.01 mg
MA#
MA000886202
PG-DSO-18-2
Package
Weight*
Average
Mass
[%]
Average
CAS#
Weight
[mg]
Sum
Mass
[%]
Sum
Construction Element
Material Group
Substances
[ppm]
if applicable
[ppm]
chip
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
silicon
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-57-5
1333-86-4
-
5.328
0.042
0.90
0.01
0.03
0.57
23.16
0.10
0.15
6.81
67.02
0.51
0.23
0.13
0.38
0.90
9000
71
9000
leadframe
phosphorus
zinc
0.169
285
iron
3.377
5704
231612
1043
1480
68066
670301
5064
2334
1260
3780
copper
137.116
0.618
23.77
0.10
237672
1043
wire
gold
encapsulation
organic material
plastics
carbon black
epoxy resin
silicondioxide
tin
0.876
40.295
396.821
2.998
inorganic material
non noble metal
noble metal
60676-86-0
7440-31-5
7440-22-4
-
73.98
0.51
0.23
739847
5064
leadfinish
plating
glue
silver
1.382
2334
plastics
epoxy resin
silver
0.746
noble metal
7440-22-4
2.238
0.51
5040
*deviation
< 10%
Sum in total: 100,00
1000000
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com