Material Content Data Sheet
Sales Product Name ILD1151
Issued
29. August 2013
83.26 mg
MA#
MA000982100
PG-SSOP-14-3
Package
Weight*
Average
Mass
[%]
Average
CAS#
Weight
[mg]
Sum
Mass
[%]
Sum
Construction Element
Material Group
Substances
[ppm]
if applicable
[ppm]
chip
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
silicon
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-57-5
1333-86-4
-
2.131
0.009
0.034
0.689
27.978
0.395
0.099
4.558
44.890
0.976
0.768
0.182
0.546
2.56
0.01
0.04
0.83
33.60
0.47
0.12
5.48
53.92
1.17
0.92
0.22
0.66
2.56
25601
103
25601
leadframe
phosphorus
zinc
414
iron
8276
copper
34.48
0.47
336046
4739
344839
4739
wire
gold
encapsulation
organic material
plastics
carbon black
epoxy resin
silicondioxide
tin
1190
54752
539186
11724
9220
inorganic material
non noble metal
noble metal
60676-86-0
7440-31-5
7440-22-4
-
59.52
1.17
0.92
595128
11724
9220
leadfinish
plating
glue
silver
plastics
epoxy resin
silver
2187
noble metal
7440-22-4
0.88
6562
8749
*deviation
< 10%
Sum in total: 100,00
1000000
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com