Material Content Data Sheet
Sales Product Name IDD04SG60C
Issued
29. August 2013
311.79 mg
MA#
MA000809444
Package
PG-TO252-3-311
Weight*
Average
Mass
[%]
Average
CAS#
Weight
[mg]
Sum
Mass
[%]
Sum
Construction Element
Material Group
Substances
[ppm]
if applicable
[ppm]
chip
noble metal
gold
7440-57-5
7440-31-5
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
0.047
0.012
0.01
0.00
0.19
0.05
0.02
52.05
0.04
0.46
8.12
37.83
1.20
0.03
0.00
150
39
non noble metal
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
tin
silicon
0.593
0.20
1902
521
2091
leadframe
iron
0.162
phosphorus
copper
0.049
156
162.275
0.118
52.12
0.04
520458
379
521134
379
wire
aluminium
carbon black
epoxy resin
silicondioxide
tin
encapsulation
1.447
4641
81221
378260
11995
277
25.324
117.939
3.740
inorganic material
non noble metal
non noble metal
inorganic material
< 10%
60676-86-0
7440-31-5
7440-02-0
7723-14-0
46.41
1.20
464123
11995
leadfinish
plating
nickel
0.086
phosphorus
0.000
0.03
1
278
*deviation
Sum in total: 100,00
1000000
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com