Material Content Data Sheet
Sales Product Name SAL-XC866-4FRA 3V BE
Issued
29. August 2013
118.23 mg
MA#
MA000914038
Package
PG-TSSOP-38-4
Weight*
Average
Mass
[%]
Average
CAS#
Weight
[mg]
Sum
Mass
[%]
Sum
Construction Element
Material Group
Substances
[ppm]
if applicable
[ppm]
chip
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
noble metal
silicon
7440-21-3
7439-95-4
7440-21-3
7440-02-0
7440-50-8
7440-57-5
1333-86-4
-
6.433
0.075
0.326
1.504
48.239
0.875
0.176
7.460
51.105
0.004
0.002
0.003
0.080
0.389
1.558
5.44
0.06
0.28
1.27
40.80
0.74
0.15
6.31
43.23
0.00
0.00
0.00
0.07
0.33
1.32
5.44
54413
636
54413
leadframe
magnesium
silicon
2757
12724
408007
7404
1490
63098
432244
37
nickel
copper
42.41
0.74
424124
7404
wire
gold
encapsulation
organic material
plastics
carbon black
epoxy resin
silicondioxide
gold
inorganic material
noble metal
60676-86-0
7440-57-5
7440-22-4
7440-05-3
7440-02-0
-
49.69
496832
756
plating
noble metal
silver
20
noble metal
palladium
nickel
23
non noble metal
plastics
0.07
1.65
676
glue
epoxy resin
silver
3294
13177
noble metal
7440-22-4
16471
*deviation
< 10%
Sum in total: 100,00
1000000
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com