Material Content Data Sheet
Sales Product Name TLE4966K
Issued
28. August 2013
13.44 mg
MA#
MA000392960
PG-TSOP6-6-5
Package
Weight*
Average
Mass
[%]
Average
CAS#
Weight
[mg]
Sum
Mass
[%]
Sum
Construction Element
Material Group
Substances
[ppm]
if applicable
[ppm]
chip
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
silicon
7440-21-3
7440-21-3
7440-32-6
7440-47-3
7440-50-8
7440-57-5
1333-86-4
-
0.856
0.001
0.005
0.016
5.414
0.019
0.050
0.063
0.126
1.149
4.922
0.299
0.155
0.064
0.300
6.37
0.01
0.04
0.12
40.28
0.14
0.38
0.47
0.94
8.55
36.63
2.22
1.15
0.47
2.23
6.37
63714
81
63714
leadframe
silicon
titanium
405
chromium
copper
1214
40.45
0.14
402830
1421
404530
1421
wire
gold
encapsulation
organic material
plastics
carbon black
brominated resin
antimonytrioxide
epoxy resin
silicondioxide
tin
3756
4696
inorganic material
plastics
1309-64-4
-
9391
85460
366257
22241
11500
4731
inorganic material
non noble metal
noble metal
60676-86-0
7440-31-5
7440-22-4
-
46.97
2.22
1.15
469560
22241
11500
leadfinish
plating
glue
silver
plastics
epoxy resin
silver
noble metal
7440-22-4
2.70
22303
27034
*deviation
< 10%
Sum in total: 100,00
1000000
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com